Through-Via Substrate Inspection Using Peripheral Test Cells
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Solution Overview
Problem
The shrinking critical dimensions of through via substrates in electronic devices complicate defect inspection and metallization processes, and there is a need for effective quality inspection of these substrates.
Innovation Solution
The method involves a non-destructive inspection step during the manufacturing of electronic devices using through via substrates, where test cells are formed in the substrate's peripheral regions, inspected, and compared to standards to determine if process parameters need adjustment or if substrates are qualified for further processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the critical dimensions of through via substrates are reduced to enable smaller electronic units, then the size and weight of electronic devices are reduced, but the difficulty of defect inspection and metallization processes increases
Solution Approach 1:
The patent applies preliminary action by forming test cells in the peripheral regions of the substrate before final inspection. These test cells are created in advance to establish reference standards for subsequent quality inspection, enabling easier detection of defects in the reduced-dimension through vias without directly inspecting the difficult small features themselves
Solution Approach 2:
The patent uses test cells as an intermediary element. Instead of directly inspecting the difficult-to-detect through vias with reduced dimensions, the inspection system measures the test cells which serve as proxy references. This intermediary approach transforms the difficult measurement problem into a more manageable comparison task
2Volume of moving object
If the critical dimensions of through via substrates are reduced, then electronic devices become smaller, but the metallization process becomes more difficult
Solution Approach 1:
The patent performs preliminary formation of test cells and quality inspection before the metallization process. By establishing quality benchmarks in advance through test cells, the metallization process can be optimized and controlled more effectively, reducing its difficulty despite the reduced dimensions
Solution Approach 2:
The patent implements a feedback mechanism where test cell measurements provide information about substrate quality and process variations. This feedback enables adjustment of metallization process parameters to compensate for the challenges posed by reduced critical dimensions, making the process more manageable
3Device complexity
If traditional inspection methods are used for through via substrates, then the manufacturing process is simpler, but the quality inspection effectiveness is insufficient
Solution Approach 1:
The patent segments the inspection approach by separating test cell measurement from final product inspection. The complex inspection task is divided into: (1) forming test cells in peripheral regions, (2) measuring test cells to establish references, and (3) comparing actual through vias against these references. This segmentation makes the overall process more manageable while improving effectiveness
Solution Approach 2:
The patent creates copies of the through via structure in the form of test cells located in peripheral regions. These test cell copies serve as reference standards that capture the expected characteristics of through vias under specific process conditions, enabling more effective quality inspection without requiring direct measurement of every production via
Data Source
AI summary
A manufacturing method includes providing a substrate including a circuit region and a peripheral region, wherein the peripheral region includes a plurality of test areas; performing a via-forming process on the first substrate, wherein the via-forming process includes forming a test cell in each test area; performing a test cell inspection step to the test cells and comparing the inspection result with inspection standard to obtain a comparison result; based on the comparison result, determining whether the parameters of the via-forming process need to be modified, or whether at least a through via or cavity of the substrate is qualified or needs to be reworked, or whether the substrate needs to be scrapped; and when the through via or cavity is determined to be qualified, forming a conductive layer in the through via or disposing an electronic unit in the cavity.