Thunderbolt Daisy-Chain Thermal Power Control

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Solution Overview

Problem

Existing electronic systems with Thunderbolt interfaces face challenges in managing the performance and temperature of peripheral devices, leading to instability and high power consumption.

Innovation Solution

An electronic system with a daisy-chain configuration and a control module that generates thermal designed power values based on device parameters, using a Thunderbolt-compatible transport protocol to communicate with a host and control device performance to prevent excessive power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If peripheral devices are connected to computers via Thunderbolt interfaces to enable innovative functions, then device connectivity and functionality are improved, but power consumption and temperature management become uncontrolled

Engineering Contradiction:
Improvedevice connectivityVSAvoidpower consumption
Core Design Contradiction:
Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The patent changes the power allocation parameters dynamically by introducing thermal designed power values (TDP) that are calculated based on device parameters and ambient temperature. The host system adjusts the power consumption parameters of peripheral devices according to thermal conditions, transforming the static power allocation into a dynamic parameter that adapts to environmental changes, thereby resolving the contradiction between device connectivity and power consumption control.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If peripheral devices operate at high performance levels, then device functionality is improved, but system stability decreases due to overheating and excessive power consumption

Engineering Contradiction:
Improvedevice performanceVSAvoidsystem stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent implements a feedback mechanism where the host system continuously monitors the operating conditions of peripheral devices and adjusts power allocation based on thermal designed power values. This closed-loop control system provides feedback between device performance and power consumption, allowing the system to maintain optimal performance levels while preventing overheating and instability, thus resolving the contradiction between productivity and reliability.

Inventive Principle:
Principle #23Feedback

3Adaptability or versatility

If multiple electronic devices are connected in daisy-chain configuration, then system versatility is improved, but thermal management and power control complexity increases

Engineering Contradiction:
Improvesystem configurationVSAvoidthermal management
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies universality by creating a standardized thermal designed power value calculation method that can be applied to any peripheral device connected in the daisy-chain configuration. The host system uses a unified approach to generate TDP values for multiple devices based on their individual parameters, eliminating the need for device-specific thermal management strategies and reducing overall system complexity despite the increased number of connected devices.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS9256262B2Electronic systems and performance control methods
Publication Date: 2016.02.09 ACER INC
  • US9256262B2 patent drawing
  • US9256262B2 patent drawing
  • US9256262B2 patent drawing

AI summary

An electronic device is provided, including a plurality of electronic devices and a control module. The electronic devices are connected in a daisy-chain configuration and overlapped in a direction, in which the electronic devices use a transport protocol compatible with a thunderbolt interface to communicate with a host. The control module generates thermal designed power values corresponding to the electronic devices according to parameters of the electronic devices and controls performances of the electronic devices according to the thermal designed power values.