THz Oscillator Substrate Layout to Isolate DC Supply Interference
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Solution Overview
Problem
Conventional THz-wave oscillators of the planar integrated type face challenges with size constraints, flexibility in design, and interference between the electromagnetic wave radiating portion and the DC supplying portion, limiting their density and integration.
Innovation Solution
The electromagnetic-wave oscillator design separates the EMW oscillating unit and the supplying unit on opposite surfaces of a substrate, connected via a penetrating electrode, allowing for increased design flexibility and reducing interference, enabling efficient electromagnetic wave transmission and high-power THz-wave generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the EMW oscillating unit and supplying unit are integrated on the same surface of the substrate, then the device complexity is reduced, but interference occurs between the electromagnetic wave radiating portion and the DC supplying portion
Solution Approach 1:
The oscillator is divided into two separate units: the EMW oscillating unit and the supplying unit. These units are positioned on opposite surfaces of the substrate, physically separating the EMW radiating portion from the DC supplying portion to eliminate interference while maintaining functional integration through the penetrating electrode connection.
Solution Approach 2:
The solution transitions from two-dimensional planar integration to three-dimensional spatial arrangement by utilizing both surfaces of the substrate. The EMW oscillating unit is disposed on one surface while the supplying unit is disposed on the opposite surface, connected via penetrating electrodes, thereby eliminating interference without sacrificing integration.
2Volume of moving object
If the oscillator size is reduced for small-sized application, then the portability is improved, but the output power decreases
Solution Approach 1:
By separating the EMW oscillating unit and supplying unit onto opposite surfaces, each unit can be optimized independently for its function while maintaining a compact overall footprint. This segmentation allows the small-sized oscillator to achieve high output power through efficient spatial utilization.
3Productivity
If the density and integration of oscillators are increased, then the productivity is improved, but interference between adjacent oscillators increases
Solution Approach 1:
The separation of EMW and DC components onto opposite surfaces allows oscillators to be densely integrated without mutual interference. Each oscillator unit can be independently positioned and connected through penetrating electrodes, enabling high-density arrays while maintaining signal integrity and eliminating cross-talk between adjacent devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the flexibility and integration density of the oscillator, facilitating the creation of a small-sized high-power THz-wave source with reduced interference, enabling efficient electromagnetic wave transmission and improved oscillation characteristics.
Implementation Method 1
The EMW oscillating unit and the supplying unit are electrically connected via a penetrating electrode formed in the substrate
Implementation Method 2
an EMW oscillating unit (194) including a gain portion, an EMW resonance portion, an EMW radiating portion, and a ground (GND) portion
Data Source
AI summary
An electromagnetic-wave oscillator includes a substrate, an EMW oscillating unit including a gain portion, an EMW resonance portion, an EMW radiating portion, and a ground (GND) portion, and a supplying unit for supplying electric power to the EMW oscillating unit. The ground portion regulates a predetermined reference electric potential for the gain portion, the EMW resonance portion, and the EMW radiating portion. The EMW oscillating unit is disposed on a first surface of the substrate. The supplying unit is disposed on a second surface of the substrate extending on an opposite side to the first surface. The EMW oscillating unit and the supplying unit are electrically connected via a penetrating electrode formed in the substrate.