Tile Sub-Array Architecture for Compact Phased Array Antennas
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Solution Overview
Problem
Conventional phased array antennas are large, heavy, and expensive due to their complex architecture, which limits their use in applications requiring compact and cost-effective solutions, especially in defense and commercial electronic systems.
Innovation Solution
The development of a tile sub-array architecture for Active Electronically Scanned Arrays (AESAs) that uses a package-less Transmit/Receive (T/R) channel and multi-layer printed circuit board structures, eliminating the need for back-drill and back-fill operations and integrating RF, DC, and logic signal distribution, resulting in a lightweight, compact, and cost-effective design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional phased array antenna architecture is used, then RF performance and reliability are improved, but size, weight, and cost increase significantly
Solution Approach 1:
The antenna system is divided into independent tile sub-arrays, each functioning as a complete phased array element. This segmentation allows the overall antenna to achieve desired RF performance through multiple smaller units rather than one large heavy structure, reducing total weight while maintaining reliability through modular redundancy
Solution Approach 2:
The patent transitions from conventional planar brick architecture to a three-dimensional multi-layer tile structure. RF circuits are distributed across multiple layers within each tile, enabling compact vertical integration that reduces the horizontal footprint and overall antenna weight while preserving RF performance
2Reliability
If conventional phased array antenna architecture is used, then RF performance and reliability are improved, but manufacturing cost increases significantly
Solution Approach 1:
By segmenting the antenna into standardized tile sub-arrays with identical multi-layer circuit board structures, the patent enables batch manufacturing and economies of scale. Each tile can be manufactured independently using the same processes, significantly reducing per-unit cost while maintaining consistent RF performance across the array
Solution Approach 2:
The patent changes the manufacturing approach from custom high-precision RF circuit fabrication to standardized multi-layer printed circuit board production. This parameter change in manufacturing methodology reduces complexity and cost while achieving the required RF performance through careful design of the layered structure
3Device complexity
If brick type architecture is used, then RF signal distribution is simplified, but antenna size and weight increase
Solution Approach 1:
The patent moves RF signal distribution from a two-dimensional planar layout in brick architecture to a three-dimensional multi-layer structure within tiles. RF circuits are distributed across multiple layers vertically, reducing the horizontal space required and overall antenna volume while maintaining signal distribution functionality through the layered interconnect structure
4Weight of stationary object
If tile architecture with package-less T/R channel is used, then size and weight are reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates alignment features and registration structures directly into the multi-layer circuit board fabrication process itself, rather than requiring post-fabrication alignment. The RF interconnects and circuit elements are positioned with precise relative locations during the board manufacturing process, establishing alignment references in advance that simplify subsequent assembly and reduce overall precision requirements
Data Source
AI summary
A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.