Tileable Sensor Array via 3D Interposer Stacking
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Solution Overview
Problem
Current techniques for constructing large area sensor arrays face challenges such as increased wire density, performance degradation due to spacing variations, and high manufacturing and repair costs, making it difficult to efficiently build and maintain these arrays.
Innovation Solution
A method for forming a tileable detector array by creating detector modules with a sensor array, an interconnect layer, and an integrated circuit, where the sensor array is coupled to the interconnect layer using a high temperature attach process, and multiple modules are tiled on a substrate to form a high-density large area sensor array.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a large number of transducer modules are arranged in rows and columns on one side of an interposer to form large area sensor arrays, then the sensor area is increased, but the wire density of the interposer increases and performance is degraded due to spacing variations
Solution Approach 1:
The patent transitions from a planar arrangement of transducer modules on one side of an interposer to a three-dimensional stacked configuration where sensor arrays and integrated circuits are arranged on opposite sides of the interposer, connected through vertical vias. This dimensional change eliminates the wire density problem by routing connections through the thickness of the interposer rather than across its surface.
Solution Approach 2:
The patent divides the large area sensor array into multiple smaller sensor arrays, each mounted on its own substrate and connected to the interposer through dedicated vias. This segmentation allows each connection path to be optimized independently, reducing the overall wire density and improving signal integrity across the large array.
2Quantity of substance
If the pitch on both the sensors and the integrated circuits is decreased to increase density, then the sensor density is improved, but the wire density of the interposer increases further
Solution Approach 1:
By routing connections vertically through the interposer thickness rather than horizontally across the surface, the patent enables higher sensor and IC pitch reduction without proportionally increasing wire density. The vertical via approach decouples the relationship between in-plane pitch and wire density.
Solution Approach 2:
The interposer acts as an intermediary structure with through-vias that mediate the connection between high-density sensor arrays and integrated circuits. This intermediary allows independent optimization of sensor pitch and IC pitch while maintaining manageable wire density through the vertical connection paths.
3Area of stationary object
If a single large area transducer is manufactured to encompass large areas, then the sensor area is increased, but the manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent segments the large area sensor system into multiple smaller sensor arrays, each manufactured separately on its own substrate and integrated circuit. These smaller units can be manufactured using standard fabrication processes, avoiding the need for specialized large-area manufacturing equipment and techniques.
Solution Approach 2:
Multiple smaller, easily manufactured sensor arrays and integrated circuits are combined through the interposer structure to create a large area sensor system. This merging approach achieves the functional equivalent of a single large transducer while retaining the manufacturing advantages of smaller components.
4Ease of manufacture
If modular sensor arrays are assembled to form large area arrays, then the manufacturing complexity is reduced, but the system size increases
Solution Approach 1:
The patent uses vertical stacking of sensor arrays and integrated circuits on opposite sides of the interposer to achieve high integration density. This three-dimensional arrangement minimizes the horizontal footprint of the system while maintaining the benefits of modular assembly.
Data Source
AI summary
A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.