Tileable Ultrasound Transducer Array Architecture
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Solution Overview
Problem
Conventional ultrasound transducer arrays face challenges in achieving large-sized arrays with high resolution and cost-effectiveness, as well as maintainability, due to gaps between modules and the need to replace entire arrays when individual modules fail.
Innovation Solution
The proposed solution involves a tileable ultrasound transducer array architecture where each module comprises a transducer array and an application-specific integrated circuit (ASIC) electrically coupled to a flexible interconnect and connector, allowing modules to be directly adjacent without gaps, enabling large-sized arrays with individually testable and replaceable modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional ultrasound transducer arrays are used, then large-sized arrays can be achieved, but gaps between modules cause resolution loss and entire arrays must be replaced when individual modules fail
Solution Approach 1:
The transducer array is divided into multiple independently testable and replaceable modules, each containing a subset of the transducer elements. This segmentation allows individual modules to be replaced without replacing the entire array, while the modular design with flexible interconnects eliminates gaps between modules, maintaining resolution across the full array aperture.
2Area of stationary object
If conventional ultrasound transducer arrays are used, then large-sized arrays can be achieved, but entire arrays must be replaced when individual modules fail
Solution Approach 1:
The transducer array is divided into multiple independently testable and replaceable modules, each containing a subset of the transducer elements. This segmentation allows individual modules to be replaced without replacing the entire array, while the modular design with flexible interconnects eliminates gaps between modules, maintaining resolution across the full array aperture.
3Area of stationary object
If conventional ultrasound transducer arrays are used, then large-sized arrays can be achieved, but costs increase due to replacement of entire arrays
Solution Approach 1:
The transducer array is divided into multiple independently testable and replaceable modules, each containing a subset of the transducer elements. This segmentation allows individual modules to be replaced without replacing the entire array, while the modular design with flexible interconnects eliminates gaps between modules, maintaining resolution across the full array aperture.
Solution Approach 2:
Each module is independently testable before final assembly, allowing defects to be identified and corrected at the module level rather than requiring testing and potential replacement of the entire array. This preliminary testing of individual modules reduces waste and manufacturing costs.
Data Source
AI summary
An ultrasound transducer array architecture and manufacturing method is provided. The method includes providing an ultrasonic transducer including a plurality of modules, each module including an ultrasonic transducer array and an application specific integrated circuit (ASIC), the ultrasonic transducer array and the ASIC electrically coupled to a flexible interconnect, the flexible interconnect coupled to a connector. The ASIC and flexible interconnect may be arranged such that each ultrasonic transducer array is directly adjacent to another ultrasonic transducer array. The ASIC may be electrically coupled to the flexible interconnect and the ASIC to the transducer array via a redistribution layer. Each of the plurality of modules may be a stack with the ultrasonic transducer array on the RDL and RDL on the ASIC, wherein the flexible interconnect extends laterally from a top surface of the ASIC and curves down to a bottom surface of the ASIC.