Tiled Array Antenna Impedance Matching via Feed Interconnections
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Solution Overview
Problem
Existing antenna designs, such as checkerboard arrays, face challenges in impedance matching across a wide frequency range, leading to limited bandwidth and efficiency in signal power transfer and noise contribution from low-noise amplifiers.
Innovation Solution
The proposed antenna device features a modified self-complementary tiled array design with conductive patches and feed interconnections that provide complementary series inductance and capacitance, along with shielding, to improve impedance matching across frequencies, reducing common mode currents and enhancing signal-to-noise ratios.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional checkerboard array designs are used, then the antenna structure is simple and easy to manufacture, but the impedance matching is poor and bandwidth is limited
Solution Approach 1:
The antenna array is divided into repeating unit cells, each containing a conductive patch and associated feed interconnections. This segmentation allows the complex impedance matching structure to be broken down into manageable, repeatable modules that can be manufactured systematically while achieving the desired broadband performance through the collective behavior of multiple units.
Solution Approach 2:
The feed interconnections are arranged in a nested configuration where conductive elements are positioned at multiple levels and orientations within each unit cell. This nesting creates complementary inductive and capacitive effects that broaden the impedance matching bandwidth without requiring proportionally increased structural complexity.
2Reliability
If conventional feed interconnections are used, then the manufacturing process is simple, but common mode currents are generated and signal-to-noise ratio is reduced
Solution Approach 1:
The feed interconnection structure is designed to intentionally generate equal and opposite common mode currents on adjacent conductors. These controlled common mode currents cancel the unwanted common mode currents that would otherwise be generated by asymmetric feeding, thereby improving signal-to-noise ratio while maintaining a manufacturing process that builds upon conventional techniques.
Solution Approach 2:
The feed interconnections employ asymmetric positioning and sizing of conductive elements within each unit cell. This asymmetry is deliberately designed to create specific current distribution patterns that suppress common mode currents while maintaining ease of manufacture through standard fabrication processes.
3Adaptability or versatility
If impedance matching is improved across wide frequency range, then bandwidth increases, but the antenna requires complex inductive elements that introduce high losses
Solution Approach 1:
The design replaces traditional lumped inductive elements with distributed inductance created by the geometry and arrangement of conductive feed interconnections. This substitution eliminates the need for separate inductive components that would introduce high losses, achieving broadband impedance matching through the inherent inductive and capacitive effects of the feed structure itself.
Solution Approach 2:
The feed interconnection geometry is optimized to provide frequency-dependent inductance and capacitance values that naturally broaden the impedance matching bandwidth. By carefully controlling the dimensions, spacing, and configuration of conductive elements, the antenna achieves wideband performance without requiring external inductive components that would increase energy losses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved impedance matching, increased bandwidth, and enhanced signal-to-noise ratios, particularly in low-noise receiving applications, without requiring high-loss inductive elements, and is applicable in fields like Astronomy, Communications, and Security.
Implementation Method 1
a series of conductive feed interconnections capacitively coupled to the spaced apart array of conductive patches
Implementation Method 2
said conductive feed interconnections being profiled to provide a complementary series inductance to said capacitive coupling
Implementation Method 3
The conductive feed interconnections may be shielded
Data Source
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AI summary
An antenna device including: a conductive ground sheet of a substantially planar form; and a series of spaced apart conductive patches arranged substantially in a plane parallel to the conductive ground plane; a series of conductive feed interconnections electromagnetically coupled to the spaced apart array of conductive patches.