Semi-Hermetic Sealing for Tiled CMOS X-Ray Detectors

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Solution Overview

Problem

Sealing large multiply-tiled CMOS x-ray detectors from moisture is challenging due to complex surface topology and increased electrical connections, which complicates the sealing process and increases costs.

Innovation Solution

A semi-hermetic sealing method using a moisture-impermeable substrate and cover with a compressible seal, allowing for reliable sealing of CMOS tiles without compromising the integrity of the seal, and providing electrical connectors across the seal to supply power and transmit signals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional sealing techniques (adhesive coating and sealant coating) are used on multiply-tiled arrays, then sealing can be applied to individual tiles, but the complex surface topology with seams between tiles allows moisture to intrude and reduces sealing effectiveness

Engineering Contradiction:
Improvesealing effectivenessVSAvoidsurface topology complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple separate tile sealing operations into a single unified sealing operation by introducing a continuous sealant layer that spans across all tile seams and surfaces simultaneously. This continuous sealant barrier eliminates the need to separately seal each tile and effectively blocks moisture intrusion paths through seams, thereby improving sealing effectiveness while simplifying the sealing process for complex tiled surfaces.

Inventive Principle:
Principle #5Merging (Combining)

2Area of stationary object

If multiply-tiled arrays are used to achieve large active image areas, then the detector can cover larger areas, but the number of electrical connections increases and sealing becomes more costly and complex

Engineering Contradiction:
Improveactive image areaVSAvoidelectrical connections and sealing complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent applies a universal sealing approach where a single continuous sealant layer serves multiple functions simultaneously: it seals individual tiles, bridges seams between tiles, provides a continuous moisture barrier across the entire array, and creates a unified surface for cover attachment. This multi-functional sealant system reduces the need for separate sealing operations and simplifies the overall sealing process for large tiled detectors.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Area of stationary object

If tiled imagers are used, then large active image areas can be achieved, but there is no continuous substrate surface for seal application, making it difficult to prevent moisture intrusion

Engineering Contradiction:
Improveactive image areaVSAvoidseal application difficulty
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent applies local quality by having the sealant layer conform to different local surface conditions: it adheres to individual tile surfaces in some areas and bridges seam gaps in other areas. The sealant is formulated to accommodate varying local topologies including tile surfaces, seam regions, and transition zones, thereby creating an effective continuous barrier despite the absence of a uniform continuous substrate surface.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP3324213B1Scintillator sealing for solid state x-ray detector
Publication Date: 2020.04.08 GENERAL ELECTRIC CO
  • EP3324213B1 patent drawingFigure 1A~1B
  • EP3324213B1 patent drawingFigure 2A~3B
  • EP3324213B1 patent drawingFigure 4A~4D

AI summary

An x-ray detector 300 may comprise: a moisture-impermeable substrate 320 including a non-monolithic conductive portion integrated with a monolithic dielectric portion; a scintillator 315 and an array of CMOS tiles 310 positioned between the scintillator 315 and the substrate 320; a cover 330 positioned on the substrate 320 and forming a seal 340 therebetween that semi-hermetically encloses the scintillator 315 and the array of CMOS tiles 310 in a covered sealed region; and analog-to-digital electronics 360 conductively coupled to the array of CMOS tiles 310 and to the conductive portion, wherein the conductive portion transmits signals from the covered sealed region to beyond the seal 340 without disrupting a semi-hermeticity of the seal 340. In this way, sealing of multiply-tiled CMOS image array detectors within a single x-ray detector 300 can be more simply and reliably achieved. Figure 3A