Tiled Display Assembly With Adhesive Bonding for Seamless Integration
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Solution Overview
Problem
Existing tiled LED display technologies lack seamless integration and are prone to defects, especially in smaller displays where imperfections are more noticeable, leading to potential unusability if a single tile is damaged.
Innovation Solution
A method involving a tile substrate with adhesive-covered backplanes, aligned tiles, and filler layers to create a seamless array, along with micro devices transferred to a substrate, patterned planarization layers, and pad electrodes for improved connectivity and light management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If mechanical approaches are used to organize and hold tiles together, then the display is adjustable and tiles can be moved around, but the integration is not seamless and defects are more noticeable
Solution Approach 1:
The display is divided into multiple individual tiles that can be separately manufactured, tested, and then permanently integrated onto a backplane. Each tile is a discrete unit containing micro-LEDs and driving circuitry, allowing for modular assembly while achieving seamless integration through the adhesive bonding method described in the patent
Solution Approach 2:
Tiles are pre-assembled, tested, and validated before being permanently integrated onto the backplane. The adhesive is applied in advance to the backplane surface, and tiles are positioned and bonded in a controlled manner before final curing, ensuring proper alignment and seamless integration before the structure becomes fixed
2Ease of repair
If tiles are mechanically held together, then tiles can be taken apart and reassembled, but the display structure becomes thicker and less integrated
Solution Approach 1:
The tile substrate and backplane are merged into a single integrated structure through adhesive bonding. The adhesive layer chemically or mechanically bonds the tile substrate to the backplane, creating a unified thin structure that eliminates the need for separate mechanical holding components and reduces overall display thickness
3Manufacturing precision
If adhesive is used to bond tiles to backplane, then integration is permanent and seamless, but tiles cannot be moved or adjusted
Solution Approach 1:
All tile positioning, alignment, and adjustments are performed before the adhesive curing process. The adhesive is applied to the backplane in advance, tiles are positioned on the adhesive layer, and only after proper alignment is achieved is the adhesive cured to permanently fix the tiles in place, ensuring both precision and permanence
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves a more permanent, slimmer, and seamless integration of tiles in displays, reducing the likelihood of defects and enhancing visual uniformity by using reflective and opaque layers to conceal imperfections.
Implementation Method 1
covering a first surface of one of the backplanes or the tile substrate with an adhesive, aligning and releasing the tiles to the backplane
Implementation Method 2
the filler layer is extended to either side of the tile depending on the view direction
Implementation Method 3
using reflective and opaque layers to conceal imperfections
Implementation Method 4
curing the adhesive
Data Source
AI summary
The present invention discloses structures and methods for making tiled displays for optoelectronic systems.