Tiled Display Module Cooling With Flexible Driving Backboard
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Solution Overview
Problem
Current small-pitch LED display solutions using a PCB substrate are not suitable for small-size display products due to limitations in flexibility and heat dissipation, affecting performance and reliability.
Innovation Solution
A display module comprising a driving backboard with a flexible printed circuit board connected to a heat dissipation component, which includes a pluggable connector and a heat dissipation channel with coolant for efficient heat management, and a tiled display device with a housing for easy assembly and signal communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a PCB substrate is used as LED carrier with driving circuit on front side and driving component on back side, then large-size display products can be achieved, but small-size display products cannot be produced due to flexibility and heat dissipation limitations
Solution Approach 1:
The patent divides the display system into separate modules: the driving circuit is integrated into a driving backboard with heat dissipation components, while the LED array remains on the display panel. This segmentation allows the display panel to be flexible and thin, while the driving backboard handles heat dissipation and circuit functions independently, resolving the contradiction between achieving small size and maintaining flexibility.
2Device complexity
If a PCB substrate with integrated driving circuit is used, then circuit integration is achieved, but heat dissipation efficiency is insufficient affecting performance and reliability
Solution Approach 1:
The patent introduces a dedicated heat dissipation component as an intermediary between the driving circuit and the environment. The driving circuit is mounted on a driving backboard that includes specialized heat dissipation structures, allowing heat to be efficiently transferred and dissipated without compromising circuit integration or increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances display brightness to over 2000 nits while maintaining low power consumption and reducing circuit complexity, improving the reliability and assembly efficiency of small-size display products.
Implementation Method 1
the heat dissipation component includes a heat dissipation plate, a heat dissipation channel provided on the heat dissipation plate, and coolant accommodated in the heat dissipation channel, wherein the coolant is configured to dissipate heat from the driving backboard
Implementation Method 2
coolant accommodated in the heat dissipation channel, wherein the coolant is configured to dissipate heat from the driving backboard
Data Source
AI summary
A display module and a tiled display device are provided. The display module includes a driving backboard and a heat dissipation component, wherein the driving backboard includes an underlaying substrate and a driving circuit disposed on the underlaying substrate, the underlaying substrate is provided with a flexible printed circuit board connected with the driving circuit, and the heat dissipation component is provided with an adapter component connected with the flexible printed circuit board, and the adapter component includes a pluggable connector.