Tiled Display Substrate Buffer Structure for Seamless Connections
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Solution Overview
Problem
In manufacturing large-sized display devices, the defect rate of light emitting elements increases due to the large number of pixels, leading to decreased productivity and reliability, and tiled display devices suffer from seams between connected units, reducing image immersion.
Innovation Solution
A display device design featuring a first substrate with a substrate buffer portion, pad electrodes, and a flexible film connected through contact holes, along with a method of manufacturing that includes etching processes to form grooves and sub-contact holes, preventing damage to the substrate during etching and minimizing seams between connected display units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple display devices are connected to form a large size tiled display, then the screen size is increased, but boundary portions (seams) appear between devices causing discontinuity and reducing image immersion
Solution Approach 1:
The patent merges multiple display devices into a single integrated structure by connecting substrates at their boundaries. The connection structure integrates multiple substrates and flexible films into one unified display system, eliminating visual seams and creating a seamless large-area display surface.
Solution Approach 2:
The patent employs a nested structure where flexible films are positioned between substrates and connection structures. The flexible films containing conductive patterns are embedded within the connection structures, creating a multi-layer nested configuration that enables seamless electrical and mechanical connections between display devices.
2Reliability
If etching is performed to form contact holes through the substrate, then electrical connection is achieved, but the substrate may be damaged during the etching process
Solution Approach 1:
The patent performs preliminary etching to form grooves in the substrate before forming contact holes. These pre-formed grooves serve as guides and reduce the etching depth required for contact holes, preventing excessive etching that could damage the substrate while ensuring proper electrical connection pathways are created.
Solution Approach 2:
The patent introduces flexible films as intermediary elements between substrates and pad electrodes. These flexible films contain conductive patterns that establish electrical connections without requiring deep penetration into the substrate, thereby avoiding substrate damage while achieving the necessary electrical connectivity.
3Shape
If the substrate thickness is reduced to minimize seams, then connection smoothness is improved, but substrate strength and damage resistance decrease
Solution Approach 1:
The patent creates a composite structure combining rigid substrates with flexible films. The flexible films, being thin and pliable, enable smooth connections between display devices while the rigid substrates maintain structural strength. This composite configuration allows seamless connections without compromising substrate integrity.
Solution Approach 2:
The patent utilizes flexible films as thin interconnection layers between substrates. These flexible films can be made extremely thin to achieve smooth, seamless connections while maintaining sufficient mechanical strength through their material properties. The flexible nature allows them to accommodate connection requirements without requiring thinning of the main substrate.
Data Source
AI summary
A display device comprises a first substrate including a first contact hole, a first barrier insulating layer disposed on the first substrate and including second contact holes overlapping the first contact hole, pad electrodes disposed on the first barrier insulating layer, at least a subset of the pad electrodes being disposed in the second contact holes, a display layer disposed on the pad electrodes, and a flexible film disposed below the first substrate and electrically connected to the pad electrodes through the first contact hole and the second contact holes, wherein the first substrate includes a substrate buffer portion overlapping the first contact hole and not-overlapping the second contact holes.