Tiled Display Fan-Out Layout for Seam and Heat Reduction
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Solution Overview
Problem
Large-sized display devices face increased defective rates of light emitting elements due to the number of pixels, leading to decreased productivity and reliability, and tiled display devices suffer from image discontinuity and reduced immersion due to seams between connected displays.
Innovation Solution
A display device design featuring fan-out lines that supply data and power voltages in different directions, integrated with pad parts and flexible films, to minimize heat generation and prevent short-circuits, while also minimizing non-display areas and seams between adjacent displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple display devices are connected to form a tiled display device, then large-sized display is achieved, but image discontinuity and reduced immersion occur due to seams between devices
Solution Approach 1:
The invention divides the display system into multiple independent display devices that can be connected to form a tiled display. Each display device is a separate unit with its own substrate, light emitting elements, and control circuits, allowing the large display area to be achieved through segmentation while maintaining individual device reliability
Solution Approach 2:
The invention employs a modular nested structure where multiple display devices are arranged in a tiled configuration. Each display device contains nested functional layers including substrate, light emitting elements, fan-out lines, and encapsulation structures, allowing compact integration while maintaining image continuity across device boundaries
2Area of stationary object
If the number of pixels is increased to achieve large display size, then display area is improved, but defective rate of light emitting elements increases
Solution Approach 1:
By segmenting the large display into multiple smaller display devices, each with fewer pixels, the invention reduces the defective rate associated with high pixel counts. Each smaller device has lower stress on individual light emitting elements and allows for better quality control during manufacturing
Solution Approach 2:
The invention changes the manufacturing parameters by producing multiple smaller display devices with optimized pixel densities rather than one large device with extremely high pixel count. This parameter change improves yield and reduces defective rates while achieving the same total display area through tiling
3Reliability
If fan-out lines are extended to supply data and power voltages, then electrical connection is improved, but heat generation increases
Solution Approach 1:
The invention transitions the fan-out lines from a two-dimensional planar configuration to a three-dimensional folded structure that extends beneath the substrate. This dimensional change allows the lines to achieve longer electrical connection paths while minimizing their projected area on the substrate surface, thereby reducing heat generation density
Solution Approach 2:
The fan-out lines are implemented as flexible conductive traces that can be folded and routed beneath the rigid substrate. This flexible film approach allows the lines to achieve complex three-dimensional paths that reduce thermal stress and heat generation while maintaining reliable electrical connections to pad parts
4Reliability
If fan-out lines are extended to prevent short-circuits, then electrical isolation is improved, but device complexity increases
Solution Approach 1:
The invention introduces an intermediary encapsulation structure that physically separates and protects the fan-out lines from the substrate and other conductive elements. This intermediary layer provides electrical isolation and prevents short-circuits while simplifying the overall design by eliminating the need for complex routing configurations
Data Source
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AI summary
A display device comprises a first substrate including a first contact hole, fan-out lines included in a first metal layer on the first substrate, first and second pad parts exposed to a lower portion of the first substrate, a display layer disposed on the fan-out lines, and a flexible film disposed below the first substrate, inserted into the first contact hole, and electrically connected to the first and second pad parts. The fan-out lines comprise first fan-out lines extending from the first contact hole in a first direction, and second fan-out lines extending from the first contact hole in a direction opposite to the first direction. The first fan-out lines and the first pad parts are integral with each other. The second fan-out lines and the second pad parts are integral with each other.