Tiled Display Through-Hole Layout for Seamless Panel Boundaries
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Solution Overview
Problem
Large-sized display devices face increased defect rates and reduced productivity due to the number of pixels, leading to a sense of disconnection and reduced immersion when multiple display devices are tiled, with visible seams causing a non-display area that detracts from the viewing experience.
Innovation Solution
A display device design incorporating a substrate, metal layers, barrier insulating layers, etching control layers, and flexible films, with controlled etching processes using specific gases and etching marks to minimize non-display areas and enhance electrical connections, reducing manufacturing costs and seam visibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple display devices are tiled to create a large-sized screen, then the display area is increased, but visible seams and non-display areas appear between devices causing a sense of disconnection
Solution Approach 1:
The patent merges the non-display areas of adjacent display devices by forming a shared etching control layer that spans across device boundaries. This layer is etched to create through-holes that allow flexible films to pass through, effectively eliminating visible seams by integrating what would otherwise be separate non-display regions into a unified structure.
Solution Approach 2:
The patent addresses the two-dimensional seam problem by introducing a third dimension - vertical through-holes penetrating multiple layers. By creating etching control layers and through-holes that extend through the thickness of the display structure, the patent eliminates seam visibility in the horizontal plane by utilizing vertical space for cable routing.
2Ease of manufacture
If traditional etching processes are used, then manufacturing is simpler, but etching rate is low and manufacturing cost increases
Solution Approach 1:
The patent changes the chemical parameters of the etching process by introducing specific etching gases (SF6, CF4, C4F8) and controlling their flow rates and pressures. These parameter changes enable high-rate etching of the inorganic barrier insulating layers while maintaining precision and control, thereby increasing productivity without sacrificing manufacturing feasibility.
Solution Approach 2:
The patent employs composite etching control layers combining organic materials (polyimide) with inorganic materials (silicon oxide, silicon nitride). This composite structure allows selective etching using different gas chemistries, enabling high etching rates for inorganic layers while maintaining process control and simplicity.
3Measurement precision
If the number of pixels is increased to achieve larger display size, then display resolution improves, but defect rate increases and productivity decreases
Solution Approach 1:
The patent segments the manufacturing process into modular stages using fan-out wiring structures. By separating the routing of data lines, gate lines, and power lines into distinct metal layers and regions, the patent enables independent optimization and testing of different pixel circuits, thereby reducing defect propagation and improving overall manufacturing efficiency while maintaining high resolution.
4Object-generated harmful factors
If non-display areas are reduced to minimize seams, then image immersion improves, but manufacturing complexity increases
Solution Approach 1:
The etching control layer serves multiple functions: it controls etching depth during through-hole formation, provides structural support across device boundaries, and enables the integration of flexible films for cable routing. This multi-functionality reduces the need for additional separate components, thereby minimizing non-display areas without proportionally increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases etching rates, minimizes non-display areas, and enhances image immersion by preventing seam recognition, thus improving the overall display quality and reducing manufacturing costs.
Implementation Method 1
a first etching process of etching the substrate, the first metal layer, and the first barrier insulating layer, and a second etching process of etching the etching control layer
Data Source
AI summary
A display device includes a substrate, a first metal layer on the substrate, a first barrier insulating layer on the first metal layer, an etching control layer on the first barrier insulating layer, a first contact hole passing through the substrate, the first barrier insulating layer, and the etching control layer, a second barrier insulating layer on the etching control layer and including a second contact hole, a fan-out line on the second barrier insulating layer and included in a second metal layer, a pad part inserted into the second contact hole and included in the second metal layer, the pad part integral with the fan-out line, a display layer on the fan-out line, and a flexible film under the substrate and inserted into the first contact hole to be electrically connected to the pad part. The first metal layer includes an etching mark adjacent to the first contact hole.