Tiled Display Calibration via Substrate Sensing

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Solution Overview

Problem

Tiled display devices often suffer from non-uniform images due to differing properties of electronic modules, which existing technologies have not efficiently addressed, particularly in terms of cost-effective solutions.

Innovation Solution

A tiled display system comprising electronic modules and sensing elements on a substrate, where the sensing elements detect signals emitted by the modules to calibrate and uniformize the image, eliminating the need for additional IC chips and reducing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If tiled display devices use multiple electronic modules to form large images, then the display area and application scope are extended, but the image uniformity deteriorates due to different properties of the electronic modules

Engineering Contradiction:
Improvedisplay areaVSAvoidimage uniformity
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The patent changes the electrical parameters (voltage or current) supplied to each electronic module based on detected signal characteristics. By adjusting these parameters, the output signals from modules with different properties are normalized, achieving uniform image display across the tiled display system.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements a feedback mechanism where sensing elements detect signals from electronic modules, and the detected information is used to adjust the driving parameters of those modules. This closed-loop control ensures that variations in module properties are compensated, maintaining image uniformity.

Inventive Principle:
Principle #23Feedback

2Manufacturing precision

If additional IC chips are added to each electronic module for calibration, then the image uniformity is improved, but the device complexity and cost increase

Engineering Contradiction:
Improveimage uniformityVSAvoidcircuit complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges the sensing function with the existing display structure by placing sensing elements on the same substrate as the electronic modules. This integration eliminates the need for separate calibration circuits and additional IC chips, reducing device complexity while maintaining calibration capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The sensing elements serve multiple functions: they detect signals from electronic modules for calibration purposes, and can potentially serve other functions in the display system. This multi-functionality reduces the need for dedicated calibration components, simplifying the overall device structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Device complexity

If sensing elements are integrated on the same substrate as electronic modules, then the cost and complexity are reduced, but the manufacturing precision of signal detection may be affected

Engineering Contradiction:
Improvecircuit complexityVSAvoidsignal detection precision
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The patent segments the substrate into distinct regions for electronic modules and sensing elements, ensuring that the sensing elements are positioned to receive signals from specific modules without interference. This spatial segmentation maintains detection precision while allowing integration on the same substrate.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves a more uniform image display by sensing and calibrating the signals from electronic modules, addressing the non-uniformity issue while reducing costs through integrated sensing elements and eliminating the need for additional IC chips.

Implementation Method 1

a plurality of sensing elements 13 disposed on the substrate 11... wherein the electronic modules 12 are arranged in a manner to expose the sensing elements 13 to signals emitted by the electronic modules 12

Methodology Applied
Scientific EffectElectromagnetic radiation detection: Photoelectric Effect

Data Source

PatentEP3675097B1Electronic device
Publication Date: 2023.09.27 INNOLUX CORP
  • EP3675097B1 patent drawingFigure 1~2B
  • EP3675097B1 patent drawingFigure 3A~3B
  • EP3675097B1 patent drawingFigure 4A~4D

AI summary

An electronic device is disclosed, which includes: a substrate; a plurality of sensing elements disposed on the substrate; and a plurality of electronic modules disposed on the substrate, each electronic module comprising a plurality of electronic elements, wherein the plurality of electronic modules are arranged in a manner to expose the plurality of sensing elements.