Tiled Display Test Circuit via Substrate Side Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Tiled display panels lack space for border regions and outer lead bonders, FPCs, COFs, or ICs due to their design, making it difficult to integrate a test circuit for monitoring resistance.
Innovation Solution
A test circuit is embedded in the substrate, extending from the top surface to the bottom surface through the side surface, with current and voltage terminals on the bottom surface for measuring resistance using an ammeter and voltmeter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a test circuit is integrated into the display panel, then monitoring capability is improved, but available space is reduced
Solution Approach 1:
The patent utilizes the side surface of the substrate as a third dimension to route the test circuit. Instead of confining the test circuit to the top surface plane, the circuit extends vertically along the side surface and exits at the bottom surface, effectively using spatial dimensionality to resolve the space conflict.
Solution Approach 2:
The test circuit is divided into multiple segments: a first circuit portion on the top surface, a second circuit portion extending along the side surface, and connection terminals on the bottom surface. This segmentation allows the circuit to utilize different surfaces of the substrate independently, optimizing space utilization.
2Measurement precision
If a test circuit is disposed on the substrate, then resistance monitoring is improved, but active area is occupied
Solution Approach 1:
The test circuit components (circuit portions and terminals) are extracted from the active area and relocated to the side surface and bottom surface of the substrate. This extraction ensures that the active area remains fully available for display purposes while the test circuit functions independently on other surfaces.
3Area of stationary object
If border regions and OLB are eliminated in tiled display panels, then display area is increased, but space for test circuits is reduced
Solution Approach 1:
By routing the test circuit through the side surface dimension, the patent eliminates the need for border regions that would traditionally accommodate test circuits. This allows tiled display panels to be closely arranged without requiring additional border space for testing functionality.
Solution Approach 2:
The side surface of the substrate serves multiple functions: it acts as a structural boundary of the display panel and simultaneously serves as a routing path for the test circuit. This multi-functionality reduces the need for dedicated border regions.
Data Source
AI summary
An electronic device includes a substrate having a top surface, a bottom surface and a side surface between the top surface and the bottom surface, and a test circuit disposed on the substrate. The test circuit extends from the top surface to the bottom surface through the side surface of the substrate and has a current terminal for an ammeter and a voltage terminal for a voltmeter, both of which are disposed on the bottom surface.