Tiled Display Panel Layout for Single-Sided Emission and Thin Bezels
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Solution Overview
Problem
Current display devices face challenges in reducing the non-display area and improving process efficiency, as they require separate surface processes for the substrate, which complicates manufacturing and increases the thickness of the panel.
Innovation Solution
A display device design where the light-emitting element is placed adjacent to the substrate, allowing for a single surface process and reducing the panel thickness, with a structure comprising a substrate, electrodes, buffer layers, thin film transistors, and interlayer insulating layers, enabling efficient light emission from the rear surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the light-emitting element is placed adjacent to the substrate, then the panel thickness is reduced and process efficiency is improved, but the manufacturing complexity increases due to the need for precise alignment and single-sided processing
Solution Approach 1:
The light-emitting element is repositioned from a traditional remote location to be adjacent to the substrate, utilizing the thickness dimension more efficiently. This spatial reconfiguration reduces overall panel thickness while maintaining functional performance, as the element operates effectively in close proximity to the substrate without requiring additional spacing layers or complex optical paths.
Solution Approach 2:
The patent integrates the light-emitting element directly adjacent to the substrate, merging previously separate functional zones into a compact configuration. This consolidation eliminates intermediate layers and reduces the number of discrete components, thereby decreasing panel thickness and simplifying the overall structure despite the increased precision required in manufacturing.
2Volume of moving object
If the light-emitting element is placed adjacent to the substrate, then the panel thickness is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The design incorporates preliminary alignment features and pre-positioned structural elements on the substrate that guide the placement of the light-emitting element. By preparing alignment references and mounting structures in advance during substrate fabrication, the system reduces the precision demands on final assembly operations, enabling the compact adjacent configuration to be achieved with manageable manufacturing tolerances.
3Productivity
If a single surface process is performed, then process efficiency is improved, but the ease of manufacture decreases due to the need for complex single-sided integration
Solution Approach 1:
The patent combines multiple functional components—light-emitting element, electrodes, buffer layers, thin film transistors, and interlayer insulating layers—into a single integrated structure fabricated on one surface of the substrate. This merging of functions into a unified monolithic structure enables single-sided processing, eliminating the need for separate front and back surface fabrication steps, thereby improving process efficiency and productivity.
Solution Approach 2:
The substrate surface is designed to perform multiple functions simultaneously: supporting the light-emitting element, providing electrical connections through integrated electrodes, housing thin film transistors for pixel control, and containing interlayer insulating structures. This multi-functional integration on a single surface reduces the number of manufacturing steps required, as one surface process accomplishes what would traditionally require multiple specialized processes on different surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances process efficiency, reduces panel thickness, and improves luminance by minimizing the side surface area of electrodes, resulting in a bezel-less display with improved heat dissipation and visual performance.
Implementation Method 1
a light-emitting element above the first electrode, and in an element contact hole penetrating the contact electrode, the buffer layer, and the gate-insulating layer
Data Source
AI summary
Provided are display device and tiled display device including a plurality of display devices. A display device includes a substrate, a first electrode above one surface of the substrate, a contact electrode above the first electrode, and contacting the first electrode, a buffer layer above the contact electrode, an active layer of a thin film transistor above the buffer layer, a gate-insulating layer above the active layer, a gate electrode of the thin film transistor above the gate-insulating layer, and a light-emitting element above the first electrode, and in an element contact hole penetrating the contact electrode, the buffer layer, and the gate-insulating layer.