Tiled Display Conductive Wire Layout for Bend Stress Balance

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Solution Overview

Problem

In large-sized electronic devices, conductive wires are prone to damage when bent, leading to reduced reliability and qualification rates due to uneven stress distribution during the connection of multiple displays.

Innovation Solution

The conductive wires in the electronic device feature a metal portion with a plurality of openings, surrounded by extending and joint portions, which allows for even stress distribution during bending, reducing the likelihood of fracture.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If the joint portion width is reduced to improve flexibility and signal transmission, then the wire's flexibility and signal transmission improve, but the bonding strength and reliability deteriorate

Engineering Contradiction:
Improvesignal transmissionVSAvoidbonding strength
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent applies parameter changes by precisely controlling the width of the joint portion (W3) to be 3-10 μm, which is narrower than the extending portions but wider than conventional designs. This optimized width parameter enables both flexible bending and reliable bonding, resolving the contradiction between flexibility and bonding strength.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies local quality by creating different width characteristics in different portions of the wire. The joint portion has a narrower width (3-10 μm) optimized for flexibility and signal transmission, while the extending portions have wider widths (15-30 μm each) optimized for bonding strength. This local differentiation resolves the contradiction by assigning different structural properties to different functional zones.

Inventive Principle:
Principle #3Local quality

2Reliability

If the joint portion width is increased to improve bonding strength, then the bonding strength improves, but the flexibility and signal transmission deteriorate

Engineering Contradiction:
Improvebonding strengthVSAvoidflexibility
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent applies parameter changes by setting the joint portion width (W3) to a specific range of 3-10 μm, which is narrow enough to maintain flexibility (allowing bending radius of 3 mm or less) while wide enough to ensure reliable bonding strength. This precise parameter optimization resolves the contradiction between bonding strength and flexibility.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies local quality by making the joint portion narrower (3-10 μm) than the extending portions (15-30 μm). This local structural differentiation allows the joint portion to provide flexibility while the extending portions provide bonding strength, resolving the contradiction through spatial distribution of functional properties.

Inventive Principle:
Principle #3Local quality

3Length of moving object

If the extending portion widths are reduced to maintain a narrow overall wire profile, then the wire profile remains narrow, but the bonding strength deteriorates

Engineering Contradiction:
Improvewire profile widthVSAvoidbonding strength
Core Design Contradiction:
Length of moving objectVSStrength

Solution Approach 1:

The patent applies local quality by creating width differentiation between the joint portion (narrow, 3-10 μm) and the extending portions (wide, 15-30 μm each). This allows the wire to maintain a narrow overall profile while having wide extending portions at the bonding locations, resolving the contradiction between narrow profile and bonding strength through local structural optimization.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent applies dimensionality change by transitioning from a uniform width structure to a variable width structure along the wire's length. The width varies from 15-30 μm at the extending portions to 3-10 μm at the joint portion, creating a tapered or stepped profile that maintains narrow overall dimensions while providing wide bonding surfaces where needed.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentEP4411701A2Tiled device and electronic device
Publication Date: 2024.08.07 INNOLUX CORP
  • EP4411701A2 patent drawingFigure 1
  • EP4411701A2 patent drawingFigure 2
  • EP4411701A2 patent drawingFigure 3

AI summary

An electronic device (10) includes a conductive wire (106). A metal portion (120) of the conductive wire (106) includes a first extending portion (1200), a second extending portion (1200), a third extending portion (1208), a fourth extending portion (1208), a first joint portion (1202), a second joint portion (1202), a third joint portion (1210), and a fourth joint portion (1210) surrounding a first opening (1220) and a second opening (1226) of the conductive wire (106). A ratio of a sum of a width (W1) of the first extending portion (1200), a width (W1) of the second extending portion (1200), a width (W5) of the third extending portion (1208), and a width (W5) of the fourth extending portion (1208) to a sum of a width (W2) of the first joint portion (1202) and a width (W6) of the third joint portion (1210) is in a range from 0.8 to 1.2.