Tiled Semiconductor Manifold for Page-Wide Printheads
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The construction of page wide inkjet printheads is complex and costly due to the need for long semiconductor manifolds, which are fragile and wasteful of wafer area, especially when manufacturing for standard letter-size paper, and the complexity of routing multiple ink channels for color printing.
Innovation Solution
A tiled ink manifold is fabricated using multiple semiconductor tiles arranged end to end on a base member, with printheads offset across the seams to minimize ink flow across boundaries, allowing each tile to feed ink to both adjacent printheads and optimizing wafer usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single long semiconductor manifold is used to span the width of the print medium, then ink delivery to all printheads is achieved, but the manifold becomes fragile and wasteful of wafer area
Solution Approach 1:
The patent divides the long semiconductor manifold into multiple smaller manifold tiles that are arranged side-by-side to collectively span the width of the print medium. Each tile is fabricated on a separate, smaller semiconductor wafer, making them less fragile and more efficient in wafer area utilization. The tiles are positioned adjacent to each other with their boundaries aligned with printhead boundaries to ensure continuous ink delivery.
2Productivity
If multiple individual printheads are mounted on a support to span the width of the print medium, then page wide printing is achieved, but the construction becomes more complicated and costly
Solution Approach 1:
The patent merges multiple individual printheads into a single integrated page-wide printhead assembly. The semiconductor manifold tiles are bonded together with the printhead nozzles to form one unified structure that spans the entire width of the print medium. This eliminates the need for separate supports and mounting mechanisms for each individual printhead, simplifying the overall construction while maintaining the ability to print across the full page width in a single pass.
3Adaptability or versatility
If a manifold is constructed to accommodate four different ink colors, then full color printing is achieved, but the manifold construction becomes more complicated with circuitous paths
Solution Approach 1:
The patent implements local quality by dedicating specific regions of each manifold tile to specific ink colors. Each manifold tile contains localized ink channels and ports configured for particular color inks, with the boundary between tiles positioned at printhead boundaries. This allows each tile to be optimized for its specific color channels while collectively providing all four color capabilities across the full width of the printhead assembly, reducing the need for circuitous inter-color routing.
Data Source
AI summary
An ink manifold constructed with a number of semiconductor tiles which are fastened end to end on a rigid base member to form a page wide print mechanism. Each tile is constructed with ink channels on one side in liquid communication with ink outlet ports on the opposite side. The ink channels carry ink from ports in the base member to the outlet ports of the tiles. The interface between each tile defines a boundary. An inkjet printhead is fastened over each boundary of the tiled manifold so that the ink inlet ports of the printhead are aligned with the ink outlet ports of the underlying tiles. No ink passes across the boundary of the adjacent manifold tiles. The fabrication of the individual tiles from a semiconductor wafer facilitates usage of the wafer when fabricating page wide print mechanisms.