Tiled Display Panel Edge Routing for Single-Sided Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Micro LED display devices face challenges in manufacturing oversized products due to mass transfer and dead pixel repair, necessitating tiling with small-sized display screens, which complicates the manufacturing process and can lead to scratches and dirt, affecting yield and quality.
Innovation Solution
A display panel design with a single-sided manufacturing process, utilizing connection traces that extend from the first surface to the second surface without requiring the backplane to be turned over, allowing for seamless tiling and reducing the risk of scratches and dirt, thereby improving yield and quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If small-sized display screens are tiled to create oversized display products, then the manufacturing capability for large screens is achieved, but the manufacturing process becomes complex and the risk of scratches and dirt increases
Solution Approach 1:
The display screen is divided into multiple small-sized display modules that are tiled together to form an oversized display. Each module contains its own light-emitting devices arranged in a matrix pattern, allowing the large display to be constructed from manageable smaller units while maintaining overall functionality
Solution Approach 2:
The connection traces are designed to extend from the first surface through the side surface to the second surface of the backplane, creating a three-dimensional routing path. This vertical dimension allows electrical connections to pass through the module without requiring the backplane to be flipped, simplifying the manufacturing process
2Ease of manufacture
If the backplane is turned over during manufacturing, then both sides can be accessed for assembly, but scratches and dirt may occur affecting yield and quality
Solution Approach 1:
The connection traces route through the thickness of the backplane from the first surface to the second surface via the side surface, creating a vertical connection path. This three-dimensional routing allows electrical connections to be established without flipping the backplane, maintaining quality while enabling assembly access
Solution Approach 2:
The side surface of the backplane serves as an intermediary pathway for the connection traces to pass through. This intermediate routing surface allows electrical connections to traverse the backplane thickness without requiring the backplane to be turned over, preventing damage while maintaining manufacturing ease
3Ease of manufacture
If traditional manufacturing processes are used, then standard production methods are applied, but the bezel width remains large reducing screen-to-body ratio
Solution Approach 1:
The connection traces are routed vertically through the backplane thickness rather than horizontally across the surface. This vertical routing through the side surface allows the display edges to be minimized, reducing bezel width and increasing screen-to-body ratio while maintaining standard manufacturing processes
Solution Approach 2:
The display is segmented into modular units with connection traces routed through the side surfaces. This segmentation allows each module to have minimized edge requirements, enabling smaller bezels and higher screen-to-body ratios while using conventional manufacturing techniques
Data Source
AI summary
A display panel includes: a backplane, light-emitting devices, first electrodes, and connection traces. The backplane includes a first surface, a second surface opposite thereto, and side surfaces connecting the two surfaces. At least one of the side surfaces is a selected side surface. The light-emitting devices are disposed on the first surface. The first electrodes are disposed on the first surface and are proximate to the selected side surface. Each connection trace includes a first trace segment, a second trace segment, and a third trace segment that are connected in sequence. The first trace segment is disposed on the first surface, and the first trace segment is electrically connected to a first electrode. The second trace segment is disposed on the selected side surface. The third trace segment is disposed on the second surface, and is configured to be electrically connected to a flexible printed circuit.