Redundant Interconnect Layout for Tiled Panel Signal Reliability
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Solution Overview
Problem
The challenge of providing reliable signal transmission in large-sized electronic devices tiled with multiple panels has not been adequately addressed, leading to potential failures due to broken connections and defective bridge members.
Innovation Solution
The electronic device incorporates a support plate with connecting lines and bridge members that facilitate signal transmission, including redundancy connections and insulating layers to ensure continuity even when individual lines or bridge members fail.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple panels are tiled together to create large-sized electronic devices, then the display area and functionality are improved, but the risk of signal transmission failures increases due to broken connections and defective bridge members
Solution Approach 1:
The patent applies beforehand cushioning by providing redundant signal transmission paths (multiple connecting lines and bridge members) that are prepared in advance. When the primary signal path fails due to broken connections or defective bridge members, the redundant paths are already in place to immediately take over, preventing signal transmission failure and maintaining display reliability in large-sized tiled electronic devices
Solution Approach 2:
The patent applies parameter changes by varying the width of holes through different layers (first hole in insulating layer has different width than second hole in second base) to optimize signal transmission characteristics. This parameter optimization ensures reliable signal transmission across the tiled panels while managing the increased complexity of multiple connections
2Reliability
If redundant connecting lines and bridge members are added to ensure signal transmission reliability, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the signal transmission system into modular components (multiple connecting lines, multiple bridge members, insulating layers with holes) that can be independently configured. This segmentation allows redundancy to be added systematically without requiring complete redesign of the entire system, thus managing complexity while improving reliability
Solution Approach 2:
The patent uses insulating layers with precisely positioned holes as intermediaries between conductive layers and bridge members. These intermediary structures organize and manage the complex interconnections, providing a structured approach to redundancy that reduces overall system complexity while maintaining signal transmission reliability
Data Source
AI summary
An electronic device including a first base, a first conductive layer, an insulating layer, a first electronic element, a second base, and a second electronic element is provided. The first conductive layer is disposed on the first base. The insulating layer is disposed on the first conductive layer and has a first hole, wherein the first hole exposes at least a portion of the first conductive layer. The first electronic element is disposed on the first base. The second base is disposed between the insulating layer and the first electronic element, and has a second hole. The second electronic element is electrically connected to the first conductive layer. The first electronic element is electrically connected to the first conductive layer via the second hole and the first hole, and in a cross-sectional view of the electronic device, the second hole is different from the first hole in width.