Seamless Tiled Patterned Films via Oxygen-Inhibited Curing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for expanding small patterned areas, such as patterned silicon wafers, to create large area products often result in mechanical weakening, loss of fidelity, and visible defects due to large seams, particularly in light management or display applications.
Innovation Solution
A method involving the use of curable materials and molds to create large area substantially seamless tiled patterned areas by curing the material in the presence of oxygen, allowing for minimal seam formation between patterned areas, using UV-transparent flexible molds and adhesion promoters to maintain pattern fidelity and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If tiling methods are used to expand small patterned areas to large area products, then the footprint is expanded, but mechanical strength is weakened and large seams are created causing defects
Solution Approach 1:
The patent divides the large area product into multiple smaller patterned areas that are tiled together. Each small patterned area is processed separately and then assembled into a large area product, allowing the footprint to be expanded while managing seam creation through controlled joining methods
Solution Approach 2:
The patent introduces intermediary materials or methods (such as adhesives, bonding agents, or intermediate layers) to join the tiled patterned areas. These intermediaries facilitate the connection between separate patterned regions while minimizing seam formation and maintaining mechanical strength across the joints
2Area of stationary object
If tiling methods are used to expand small patterned areas, then the footprint is expanded, but fidelity of patterned areas is lost due to large seams
Solution Approach 1:
The patent applies different quality standards or processing methods to different regions of the patterned areas. Specifically, the joining regions (seams) are treated differently from the main patterned regions, with special attention given to minimizing seam visibility and maintaining pattern fidelity in critical areas through localized processing or masking techniques
3Ease of manufacture
If physical or chemical attachment methods are used for tiling, then patterned areas can be joined, but visible defects and fluid trapping occur in large seams
Solution Approach 1:
The patent employs temporary or sacrificial elements during the manufacturing process that are removed or become negligible in the final product. This may involve using temporary bonding agents or fixtures that facilitate joining during manufacturing but do not persist as visible defects in the finished product, thereby eliminating harmful factors like fluid trapping
Solution Approach 2:
The patent modifies physical or chemical parameters of the attachment process or materials to reduce seam formation. This could involve changing adhesive viscosity, bonding pressure, temperature, or curing conditions to create stronger, less visible seams that do not trap fluid, thereby reducing harmful factors while maintaining ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces high fidelity seams with minimal defects, enhancing the mechanical strength and optical performance of large area products, suitable for applications in displays and light management.
Implementation Method 1
curing the material upon contact with UV radiation
Implementation Method 2
curing the material in the presence of oxygen... curing the first portion of the curable material... curing the second portion of the curable material
Data Source
Figure 1A~1E
Figure 2A~2F
Figure 3A~3F
AI summary
A large area patterned film includes a first patterned area; a second patterned area; and a seam joining the first patterned area and the second patterned area, wherein the seam has a width less than about 20 micrometers. A method for tiling patterned areas includes depositing a predetermined thickness of a curable material; contacting a first portion of the curable material with a mold; curing the first portion of the curable material; removing the mold from the cured first portion of the curable material; contacting a second portion of the curable material with the mold, such that the mold contacts a portion of the cured first portion of the curable material; curing the second portion of the curable material; and removing the mold to yield a seam between the cured first portion of the curable material and the cured second portion of the curable material, wherein the seam has a dimension less than about 20 micrometers.