Tiled Image Sensor Layout for Large-Area Detection at Lower Cost

The image sensor is divided into multiple independent image sensor dies (first, second, third, and fourth dies) that are arranged in a tiled configuration. Each die contains a subset of the total pixels, and together they form a complete large-area detection region. This segmentation allows the system to achieve a large detection area without requiring a single large silicon wafer, thereby reducing manufacturing costs while maintaining the desired detection region size.

Multiple image sensor dies are merged into a single tiled array structure where the dies are closely spaced and electrically connected through conductive wiring. The lens layer is positioned above the entire array to provide unified optical coverage. This merging approach creates a compact packaged sensor that functions as a single large-area detector without requiring the large physical spacing that would result from using separate packaged sensors.

The high-resolution pixel array is segmented across multiple smaller image sensor dies rather than requiring a single large wafer. Each die maintains high manufacturing precision standards while the collective array achieves the desired overall resolution. This approach allows standard wafer fabrication processes to be used for each die, avoiding the need for expensive large-wafer processing while still achieving high-resolution imaging across the entire tiled detection region.