Tiled Substrate Electronic Assembly for Flexible Display Sizing

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Solution Overview

Problem

Conventional electronic device manufacturing processes are inflexible and costly, requiring different thin-film substrates and manufacturing processes for various product sizes and functions, limiting product diversity and increasing production expenses.

Innovation Solution

An electronic device design featuring a sustaining layer with substrates, photoelectric units, signal layers, driving structures, and a constraining structure, allowing for flexible assembly and customization through a tiling process, where substrates are arranged to form larger units with photoelectric elements and driving structures connected via signal layers, enabling easy fabrication of products in different sizes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If different thin-film substrates and manufacturing processes are used for various product sizes and functions, then product functionality is achieved, but manufacturing flexibility is reduced and production costs increase

Engineering Contradiction:

Improveproduct size and function customizationVSAvoidmanufacturing process complexity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The device is divided into multiple independent substrates that can be manufactured separately using a standardized process and then assembled together. Each substrate contains specific photoelectric units and driving structures, allowing modular customization for different product sizes and functions without requiring different manufacturing processes for each product variant

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A universal substrate design and standardized manufacturing process is created that can be used across all product variants. The substrates follow common structural standards and connection interfaces, enabling the same manufacturing process to produce substrates for different product sizes and functions by simply changing the arrangement and quantity of photoelectric units

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If different thin-film substrates and materials are used for various product sizes, then product specifications are met, but production costs increase

Engineering Contradiction:

Improveproduct size variationVSAvoidmaterial variety and cost

Core Design Contradiction:

Adaptability or versatilityVSQuantity of substance

Solution Approach 1:

All substrates use the same material composition, structure, and manufacturing process standards. The homogeneity of substrate materials and processes eliminates the need for different expensive materials for different product sizes, while size variation is achieved by changing only the number and arrangement of photoelectric units on the standardized substrates

Inventive Principle:

Principle #33Homogeneity

3Adaptability or versatility

If multiple manufacturing processes are used for different product sizes, then product customization is achieved, but manufacturing efficiency is reduced

Engineering Contradiction:

Improveproduct customizationVSAvoidmanufacturing efficiency

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

By segmenting the device into standardized substrates that can be manufactured through a single efficient process and then assembled modularly, the system achieves product customization without sacrificing manufacturing efficiency. The segmentation allows parallel production of multiple substrate types using the same process, improving overall productivity compared to producing each product variant through a complete separate manufacturing process

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Substrates are manufactured in advance using a standardized process and stored as modular components. This preliminary action allows the final product assembly to be quickly configured for different sizes and functions by simply selecting and arranging pre-manufactured substrates, significantly improving manufacturing efficiency compared to producing complete devices from scratch for each customization

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS11923376B2Electronic device

Publication Date: 2024.03.05 PANELSEMI CORP

AI summary

An electronic device includes a sustaining layer, multiple substrates, multiple photoelectric units, multiple signal layers, multiple driving structures, and a constraining structure. The substrates are arranged on a contact surface of the sustaining layer. A first end edge of at least one substrate approaches a first end edge of the sustaining layer, and a first side edge of one substrate is adjacent to a second side edge of another substrate. The photoelectric units are arranged on the first or/and second surfaces of the substrates. The signal layers are arranged on the substrates and electrically connected to the photoelectric units. The driving structures are electrically connected to the substrates and disposed close to the first or second end edge of the sustaining layer. The constraining structure constrains the first or second end edge of the sustaining layer, and at least one driving structure is accommodated in the constraining structure.