Tilt-Polished Integrated Circuit Die Layout Reconstruction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for inspecting integrated circuits are time-consuming and inefficient, often failing to reveal complete layout information due to layer coverage and potential element loss during polishing, which hinders accurate analysis of vertical spatial relations between components.
Innovation Solution
Polishing an integrated circuit die at a tilt angle to form an inclined surface, followed by image capture and overlapping of images to reconstruct the layout design, allowing for the accurate representation of repeating unit structures and their spatial relationships.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If layer-by-layer etching and polishing is used to reveal IC layout structure, then design information can be obtained, but the process is time-consuming and some components may be lost or not seen
Solution Approach 1:
The patent applies dimensionality change by polishing the integrated circuit die at a tilt angle (e.g., 5-45 degrees) rather than perpendicular to the surface. This creates an inclined polished surface that exposes multiple layers simultaneously in a single viewing plane, transforming the traditional layer-by-layer sequential exposure into a multi-layer simultaneous exposure. The tilt angle allows light to pass through different depths of the die, revealing components from multiple layers in one image, thereby dramatically reducing inspection time while maintaining layout information completeness.
2Loss of information
If perpendicular polishing is used to reveal components layer by layer, then layout structure can be inspected, but vertical spatial relations between components cannot be determined
Solution Approach 1:
By polishing at a tilt angle, the patent creates an inclined surface where components from different vertical layers are projected onto a single two-dimensional viewing plane at different apparent depths. This allows the human eye or imaging system to perceive vertical spatial relationships between components (such as which component is above or below another) that would be invisible in traditional perpendicular polishing. The tilt angle transforms three-dimensional vertical relationships into visible depth cues in the image plane.
3Loss of information
If repeated etching and polishing steps are performed to expose all layers, then complete layout information is obtained, but the process becomes complex and time-consuming
Solution Approach 1:
The patent applies partial action by performing a single polishing step at a tilt angle that exposes sufficient layers to obtain complete layout information, rather than performing multiple sequential etching and polishing steps. The tilt angle is chosen to be sufficient (e.g., 5-45 degrees) to reveal all necessary components and their spatial relationships in one operation. This partial action approach achieves the goal of complete information exposure with a single simplified step, reducing process complexity while maintaining information completeness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables fast and accurate extraction of integrated circuit layout designs by revealing all layers and maintaining element integrity, providing detailed vertical spatial information without the need for extensive layer-by-layer etching or polishing.
Implementation Method 1
The integrated circuit die is polished with a tilt angle to form an inclined polished surface
Data Source
AI summary
A method for obtaining a layout design for an existing integrated circuit, in which, an integrated circuit die is polished with a tilt angle to form an inclined polished surface and one or more images of the inclined polished surface are obtained. The images may be overlapped directly, or the image or the images may be utilized to provide information to obtain a layout design comprising at least one repeating unit structure of the layout structure.