Tiltable Bond Head Alignment for Non-Parallel Die Bonding
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Solution Overview
Problem
The challenge in semiconductor packaging is achieving effective bonding between semiconductor IC dies and target substrates with varying thickness and surface planarity, leading to poor or defective connections due to non-parallel interfacing surfaces, which affects device performance and yield.
Innovation Solution
A die bonding tool with a tiltable bond head that includes an actuator system and contact sensors to detect initial contact and adjust the bond head's orientation, allowing for improved alignment and contact between bonding structures on the IC die and target substrate, even when surfaces are not parallel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If bonding is performed on substrates with varying thickness and surface planarity, then bonding coverage area is reduced, but manufacturing complexity increases due to the need for tilt adjustment mechanisms
Solution Approach 1:
The bond head is designed with dynamic tilt adjustment capability, allowing it to change its orientation angle during the bonding process. This enables the bond head to adapt to substrates with varying surface planarity and thickness, maintaining optimal bonding alignment precision without requiring multiple fixed-position bond heads or complex repositioning mechanisms.
Solution Approach 2:
The system changes the orientation parameter (tilt angle) of the bond head to compensate for substrate variations. By adjusting the tilt angle within a specific range, the system maintains effective bonding contact across substrates with different thicknesses and surface planarities, thereby preserving bonding alignment precision while avoiding the need for more complex mechanical systems.
2Manufacturing precision
If bond head tilt adjustment is implemented, then bonding uniformity improves, but device complexity and control difficulty increase
Solution Approach 1:
The system incorporates sensors that detect the actual bonding contact status and provide feedback to the control system. Based on this feedback, the actuator system automatically adjusts the bond head tilt angle to achieve optimal bonding uniformity. This closed-loop control approach simplifies the overall system by using intelligent control algorithms rather than requiring complex mechanical adjustment mechanisms.
Solution Approach 2:
The actuator system is designed with multi-functionality, serving both the tilt adjustment function and integrating with the overall positioning and control system. This universal design approach reduces device complexity by consolidating functions into a single integrated system rather than requiring separate dedicated mechanisms for each function.
3Reliability
If contact sensors are used to detect initial contact, then bonding reliability improves, but device complexity and cost increase
Solution Approach 1:
The contact sensors detect the initial contact between the bonding structure and substrate before the actual bonding process begins. This preliminary detection allows the system to establish the correct bonding position and orientation in advance, ensuring reliable bonding connections while using a relatively simple sensor system that only needs to detect contact presence rather than measuring multiple parameters simultaneously.
Data Source
AI summary
A die bonding tool includes a bond head that secures a semiconductor die against a planar surface of the bond head, an actuator system that moves the bond head and the semiconductor die towards a surface of a target substrate, and at least one contact sensor configured to detect an initial contact between a first region of the semiconductor die and the surface of the target substrate, where in response to detecting the initial contact between the semiconductor die and the target substrate, the actuator tilts the planar surface of the bond head and the semiconductor die to bring a second region of the semiconductor die into contact with the surface of the target substrate and thereby provide improved contact between the semiconductor die and the target substrate and more effective bonding including instances where the planar surface of the bond head and the target substrate surface are not parallel.