Tiltable Soldering Module for Circuit Board Adaptability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing soldering technologies, such as selective soldering, often compromise on the soldering angle for circuit boards, which does not optimally address the soldering properties of individual components, leading to suboptimal solder quantity and thermal load.
Innovation Solution
A soldering module with a tiltable linear conveyor and a movable soldering nozzle, allowing for adjustable angles and positions to better match component requirements, combined with a flux module and preheating module for improved solder adhesion and reduced thermal stress, and an inert gas device to minimize oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a fixed soldering angle is used for wave soldering, then the soldering process is simple and fast, but the solder quantity and thermal load cannot be optimized for individual components
Solution Approach 1:
The linear conveyor is made tiltable about a tilting axis, allowing the circuit board to be inclined at adjustable angles (e.g., 4° to 10°) relative to the solder wave. This dynamic adjustment capability enables optimization of solder quantity and thermal load for different components while maintaining a relatively simple wave soldering mechanism.
Solution Approach 2:
The soldering angle is changed as a variable parameter by tilting the linear conveyor. This allows the system to adapt to different component requirements by adjusting the inclination angle, thereby optimizing solder application without requiring completely different soldering setups for each component type.
2Manufacturing precision
If the circuit board is moved over the solder wave at a fixed angle, then the throughput is high, but the solder quantity adhering to the circuit board is suboptimal
Solution Approach 1:
The linear conveyor's tilting capability allows dynamic adjustment of the circuit board angle during the soldering process. This enables precise control over solder quantity adherence while maintaining continuous movement through the solder wave, thus preserving throughput efficiency.
Solution Approach 2:
The linear conveyor can be tilted to the optimal angle before the circuit board enters the solder wave, ensuring that the correct solder quantity is applied from the start of the process. This preliminary positioning prevents the need for rework or adjustment during soldering, maintaining high productivity.
3Quantity of substance
If a larger soldering angle is used, then the solder quantity adhering to the circuit board increases, but the thermal load on components increases
Solution Approach 1:
The soldering angle is used as a controllable parameter that can be precisely adjusted. By optimizing this angle, the system achieves the right balance between solder quantity adherence and thermal load, allowing different angles for different component types to minimize thermal stress while ensuring adequate solder coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for more precise and efficient solder application, reducing thermal load and oxidation, and enabling better adaptation to various component heights and layouts, enhancing the soldering process's automation and flexibility.
Implementation Method 1
the solder emerging from the soldering nozzle can run off back into the solder bath
Implementation Method 2
a preheating module (10) arranged upstream of the soldering module (3) for heating a populated circuit board (14)
Implementation Method 3
a flux module (9) for applying flux to a populated circuit board (14)
Implementation Method 4
an inert gas device to minimize oxidation
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The invention relates to a soldering module (3) for the, in particular selective, soldering of components to a circuit board (14), having a soldering nozzle (32) for creating a solder wave. It is proposed that the soldering module (3) comprises a linear conveyor (8), in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board (14) by moving the circuit board (14) in a conveying direction over the solder wave, and that the linear conveyor (8) is tiltable, in particular about a first tilting axis (23).