Tiltable Solidification Substrate with Peeling Mechanism
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Solution Overview
Problem
Existing three-dimensional rapid prototyping methods face challenges in creating smooth, planar surfaces for solidification, leading to complexity and potential deformation or breakage of objects due to high separation forces required to separate solidified material from the reference plane.
Innovation Solution
A system and method utilizing a bi-directionally tiltable solidification substrate with a peeling mechanism and force sensor to facilitate the separation of solidified material from the substrate, ensuring accurate and precise object creation without deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a smoothing blade or doctor blade is used to remove irregularities in the surface profile of solidifiable polymeric resin, then the surface smoothness is improved, but the device complexity increases due to additional moving parts
Solution Approach 1:
The patent removes the smoothing blade component entirely from the system. Instead of using a mechanical blade to smooth the resin surface, the invention relies on the natural planarity provided by the solidification substrate itself, thereby eliminating the complex moving parts associated with blade mechanisms while maintaining surface smoothness requirements.
Solution Approach 2:
The solidification substrate serves its dual function of both supporting the solidifiable material and providing a smooth, planar surface through its own inherent properties. The substrate's rigid or semi-rigid structure naturally maintains surface planarity without requiring external smoothing mechanisms, allowing the system to smooth itself without additional components.
2Manufacturing precision
If a transparent or translucent rigid layer is placed on top of the exposed surface of solidification material, then the surface planarity is improved, but the object may deform or break due to high separation forces required to separate solidified material from the reference plane
Solution Approach 1:
The patent introduces a release layer as an intermediary between the solidification substrate and the solidified object. This release layer has controlled adhesion properties that allow the object to be easily separated from the substrate after solidification without requiring high separation forces, thereby preventing deformation or breakage while maintaining surface planarity.
Solution Approach 2:
The invention changes the adhesion parameter of the interface between the solidification substrate and the solidifiable material by introducing the release layer. This layer provides optimal adhesion during solidification (maintaining contact for planarity) but allows easy release afterward (reducing separation forces), effectively decoupling the contradictory requirements of strong bonding and easy separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of three-dimensional objects with improved accuracy and reduced risk of deformation or breakage by using a tiltable substrate and peeling mechanism to manage separation forces effectively.
Implementation Method 1
The solidification substrate facilitates the creation of a substantially planar surface of solidification material which is exposed to energy provided by a pattern generator
Implementation Method 2
The components produced may range in size from small to large parts. The manufacture of parts may be based on various technologies including photo-polymer hardening using light or laser curing methods
Implementation Method 3
A system and method utilizing a bi-directionally tiltable solidification substrate with a peeling mechanism and force sensor to facilitate the separation of solidified material from the substrate
Data Source
AI summary
A solidification substrate assembly for making a three-dimensional object from a solidifiable material includes a solidification substrate assembly. In certain examples, the solidifiable material solidifies in contact with the solidification substrate, and the tilting of the substrate and/or or the use of a peeling member facilitates separation of the substrate from the solidified material. In other examples, the solidification substrate assembly includes a film that is adjacent to a rigid or semi-rigid layer. The solidifiable material solidifies in contact with the film, and a peeling member peels the film away from the solidified material. Intelligent solidification substrate assemblies are also described in which a force sensor determines when to expose the solidifiable material to solidification energy and/or whether to use a peeling member to separate the solidification substrate from a solidified objection section.