Tilted Component Carrier Structure for High-Density Vertical Connections
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Solution Overview
Problem
Conventional methods for forming electric connections in component carriers face limitations in miniaturization and high-density connection requirements, especially for high I/O count and high-frequency signal transmission, as they struggle to create compact and efficient connections with small dimensions.
Innovation Solution
The solution involves using a second component carrier tilted at an angle, such as 90°, to be inserted into a cavity or attached to a sidewall of a first component carrier, utilizing its electrically conductive layers to establish compact high-density vertical connections, which is easier to manufacture than traditional vertical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional procedures are used to form electric connections in stacked component carriers, then the connections can be established with standard manufacturing processes, but the connection dimensions become too large and the density is insufficient for miniaturization requirements
Solution Approach 1:
The patent introduces a tilted component carrier arranged at an angle (e.g., 45° or 60°) relative to the main component carrier, transforming the conventional vertical stacking arrangement into a multi-dimensional configuration. This angular arrangement allows electric connections to be formed with smaller dimensions by utilizing the tilted orientation, while standard manufacturing processes remain applicable.
2Adaptability or versatility
If the number of contacts and components on component carriers is increased to achieve higher functionality, then the product capabilities improve, but the spacing between contacts becomes smaller and conventional contacting procedures reach their limits
Solution Approach 1:
By arranging the second component carrier at a tilt angle rather than directly stacking it vertically, the patent creates additional spatial dimensions for routing electric connections. This allows multiple contacts to be connected with smaller spacing while maintaining manufacturability, as the tilted arrangement provides more flexibility in connection path design.
Solution Approach 2:
The patent divides the electric connection structure into multiple segments: connections within the main component carrier, connections through the tilted second component carrier, and connections to the third component carrier. This segmentation allows each segment to be optimized independently, enabling high contact density while using standard manufacturing processes for each segment.
3Ease of manufacture
If vertical electric connections are formed using copper filled vias or conventional methods, then the connections can be established straightforwardly, but the structures become larger in size and more difficult to manufacture at tiny dimensions
Solution Approach 1:
The tilted arrangement of the second component carrier transforms the conventional vertical connection path into an angled path that utilizes three-dimensional space more efficiently. This allows smaller connection structures to be formed while maintaining ease of manufacture, as the angled configuration provides better access for manufacturing processes compared to tightly packed vertical vias.
Data Source
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AI summary
An electronic device (100) comprising a first component carrier (102) comprising a stack of at least one first electrically conductive layer structure (104) and at least one first electrically insulating layer structure (106), and a second component carrier (108) comprising a stack of at least one second electrically conductive layer structure (110) and at least one second electrically insulating layer structure (112) and being connected with the first component carrier (102) so that a stacking direction of the first component carrier (102) is angled with regard to a stacking direction of the second component carrier (108).