Tape Bonding Machine With Tilted Frame to Prevent Bubbles
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Solution Overview
Problem
The existing methods for bonding a self-adhesive tape to an object, such as a semiconductor wafer, often result in air bubbles and wrinkles due to premature contact of the adhesive surface with the object, leading to insufficient adhesion.
Innovation Solution
A bonding machine and method that utilize a holding table, frame table, and bonding press element to perform the bonding in a non-parallel state, maintaining a greater distance between the adhesive tape and object at the forward position during the bonding process, and using a biasing element to guide the frame closer to the object, while optionally heating the adhesive tape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the self-adhesive tape is pressed against the object by a roller, then bonding pressure is applied to achieve adhesion, but the adhesive surface may come into contact with the object prematurely, causing air bubbles and wrinkles
Solution Approach 1:
The frame is supported in a non-parallel state before the bonding press element applies pressure, positioning the adhesive surface at a distance from the object. This preliminary positioning prevents premature contact while allowing controlled bonding progression as the frame is gradually brought parallel to the object during pressing
Solution Approach 2:
The frame table is configured to dynamically adjust the frame's orientation from a non-parallel state to a parallel state during the bonding process. This dynamic adjustment allows the bonding pressure to be applied progressively from one end to the other, preventing air bubbles and wrinkles while ensuring complete adhesion
2Manufacturing precision
If the frame is supported in a non-parallel state during bonding press, then premature bonding is prevented, but the bonding process becomes more complex
Solution Approach 1:
The frame table changes the geometric parameter of the frame's orientation angle during the bonding process. By dynamically adjusting the angle from non-parallel to parallel, the system achieves uniform bonding without requiring complex additional components, utilizing parameter change as the primary control mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents premature bonding, ensuring proper adhesion of the self-adhesive tape to the object without air bubbles or wrinkles, thereby forming a stable frame unit.
Implementation Method 1
the frame table may include at least one biasing element configured to bias a portion of the frame supported on the frame table, the portion being forward in the moving direction of the bonding press element relative to the holding table during at least the bonding press, in a direction away from the object held on the holding table
Implementation Method 2
a circular self-adhesive tape is bonded to a ring frame. The self-adhesive tape self-adheres at a peripheral edge portion thereof to the ring frame
Implementation Method 3
perform bonding press to move the bonding press element and the holding table relative to each other along a direction intersecting a direction of a pressing force of the bonding press element
Data Source
AI summary
A bonding machine of bonding a self-adhesive tape to an object is provided. The bonding machine includes a holding table configured to hold the object, a frame table configured to support the frame such that the frame opposes the object, a bonding press element configured to press the self-adhesive tape against the object with the self-adhesive tape, the self-adhesive tape being held on the frame, held between the bonding press element and the object, and a bonding and moving mechanism configured to perform bonding press to move the bonding press element and the holding table relative to each other along a direction intersecting a direction of a pressing force of the bonding press element. The frame table is configured to support the frame in a non-parallel state with the holding table upon bonding press.