Tilted Membrane Electrolyte Distribution for Uniform Plating
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Solution Overview
Problem
Existing chemical and electrolytic surface treatment systems for substrates, particularly in the microelectronic industry, face challenges in achieving high uniformity and speed while protecting expensive and oxidation-sensitive electrolyte mixtures from side reactions. These systems often require complex and large equipment to ensure uniform distribution of the plating electrolyte and current.
Innovation Solution
The system comprises a catholyte chamber, an anolyte chamber separated by a tilted membrane, a distribution body with jet and drain openings, and an eccentric catholyte outlet. This configuration ensures uniform deposition, protects the electrolyte mixtures, and allows for a more compact and simplified system design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If complex equipment with symmetric electrolyte draining system is used to achieve high uniformity deposition, then deposition uniformity is improved, but device complexity and size increase
Solution Approach 1:
The patent applies asymmetry by positioning the catholyte outlet eccentrically (off-center) relative to the distribution body axis. This asymmetric outlet position, combined with the tilted membrane, creates an optimized flow pattern that achieves uniform deposition without requiring complex symmetric draining systems. The asymmetric configuration simplifies the overall device structure while maintaining high deposition uniformity.
2Productivity
If hardware features like HSP-system or two-electrolyte plating system are added to improve plating speed and uniformity, then plating speed and uniformity are improved, but device complexity and outer dimensions increase
Solution Approach 1:
The patent merges the functions of electrolyte distribution, bubble removal, and flow control into a single integrated distribution body structure. The distribution body combines jet openings for electrolyte delivery, drain openings for catholyte removal, and works in conjunction with the tilted membrane for bubble separation. This integration achieves high plating speed and uniformity without requiring separate HSP-system or two-electrolyte system components, thereby reducing device complexity.
3Object-affected harmful factors
If tilted membrane is used to merge and remove bubbles, then electrolyte protection from oxidation is improved, but device complexity increases
Solution Approach 1:
The tilted membrane structure enables self-service bubble removal by utilizing the natural flow of anolyte and catholyte through the system. The membrane's tilt angle causes bubbles to coalesce and move toward the anolyte outlet under the influence of fluid flow and gravity, eliminating the need for additional mechanical bubble removal devices. This passive bubble management protects the electrolyte from oxidation while maintaining simple system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high uniformity and speed in surface treatment while effectively protecting the electrolyte mixtures, and its compact design reduces complexity and costs. The synergistic effect of the claimed features provides ideal uniformity and high-speed treatment while minimizing system size and complexity.
Implementation Method 1
The membrane is tilted so as to merge and remove bubbles generated at the anode. The removing of bubbles may be supported by the anolyte flow.
Implementation Method 2
The distribution body comprises jet openings for distributing a catholyte onto the substrate to be treated
Implementation Method 3
drain openings for draining the catholyte out of a reaction space between the distribution body and the substrate
Implementation Method 4
the catholyte chamber is separated from the anolyte chamber by means of a membrane
Implementation Method 5
The chemical and/or electrolytic surface treatment of a substrate may comprise an electroplating process, in particular, electroplating of gold (Au), SnAg, Cu, and/or other metals.
Data Source
AI summary
The disclosure relates to a system for a chemical and/or electrolytic surface treatment of a substrate comprises a catholyte chamber, an anolyte chamber, a distribution body, and a catholyte outlet. The distribution body is arranged in the catholyte chamber and the catholyte chamber is separated from the anolyte chamber by means of a membrane, wherein the membrane is tilted relative to the distribution body. The distribution body comprises jet openings for distributing a catholyte onto the substrate to be treated and drain openings for draining the catholyte out of a reaction space between the distribution body and the substrate. The catholyte outlet is arranged at the catholyte chamber in an eccentric position.