Tilted Package Cleaning Conveyor for Narrow Connector Gaps

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Solution Overview

Problem

The challenge in cleaning package devices with high component density, such as those using Package-on-Package (PoP) technology, is the efficient removal of contaminants from narrow gaps between conductive connectors, where capillary forces reduce the flow rate of cleaning solutions.

Innovation Solution

A package device cleaning apparatus with a conveyor system that tilts the package device during cleaning, allowing cleaning solutions to flow through gaps between conductive connectors with increased flow rate due to gravity, thereby improving cleaning performance and efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If package devices use high component density packaging techniques (such as Package-on-Package technology), then integration density and component density are improved, but cleaning efficiency deteriorates due to narrow gaps between conductive connectors reducing cleaning solution flow rate

Engineering Contradiction:
Improvecomponent densityVSAvoidcleaning efficiency
Core Design Contradiction:
Quantity of substanceVSProductivity

Solution Approach 1:

The conveyor belt is tilted at a specific angle (e.g., 10-45 degrees) during the cleaning process to dynamically change the orientation of the package device. This dynamic adjustment allows gravity to enhance the flow rate of cleaning solution through the narrow gaps between conductive connectors, thereby improving cleaning efficiency while maintaining high component density

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the physical parameter of the conveyor belt orientation from horizontal to tilted at a specific angle. This parameter change utilizes gravitational force to increase the flow rate of cleaning solution through narrow gaps, resolving the contradiction between high component density and cleaning efficiency

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the minimum feature size is reduced to increase integration density, then more components can be integrated into a given area, but the gaps between conductive connectors become narrower, reducing cleaning solution flow rate

Engineering Contradiction:
Improveintegration densityVSAvoidcleaning solution flow rate
Core Design Contradiction:
Manufacturing precisionVSSpeed

Solution Approach 1:

By tilting the conveyor belt during cleaning, the system dynamically adjusts the orientation to allow gravity to accelerate the cleaning solution flow through progressively narrower gaps, maintaining effective cleaning despite reduced feature sizes and increased integration density

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent introduces a dimensional change by tilting the package device at an angle, adding a gravitational component to the cleaning solution flow. This dimensional adjustment compensates for the reduced gap width caused by smaller feature sizes, maintaining sufficient flow rate for effective cleaning

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The tilted conveyor system enhances the flow rate of cleaning solutions through narrow gaps, ensuring sufficient momentum to carry contaminants out, thereby improving cleaning efficiency and performance.

Implementation Method 1

the cleaning solution flowing through gaps between conductive connectors of the package device may have an increased flow rate accelerated by gravity

Methodology Applied
Scientific EffectGravity: Gravitation

Data Source

PatentUS12322608B2Apparatus and methods for cleaning a package
Publication Date: 2025.06.03 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12322608B2 patent drawing
  • US12322608B2 patent drawing
  • US12322608B2 patent drawing

AI summary

An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.