Tilted PVD Source and Rotating Pedestal for Film Uniformity
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Solution Overview
Problem
The challenge in electronic device fabrication is achieving film uniformity during physical vapor deposition (PVD) on large-area substrates, particularly due to the high cost and fragility of large-area targets, low power density, and non-uniform deposition issues when using multiple targets in conventional PVD chambers.
Innovation Solution
A compact PVD chamber design featuring a rotating pedestal and a tilted target with cooling channels, along with a magnetron that can oscillate in multiple directions, allowing for simultaneous co-sputtering and scanning to improve film uniformity and extend target life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If large-area targets are used for PVD processing, then the substrate coverage area is improved, but the target cost and fragility increase significantly
Solution Approach 1:
The patent divides a large-area target into multiple smaller modular targets that can be independently positioned and processed. This segmentation reduces the fragility and manufacturing difficulty of individual targets while collectively covering the required large substrate area, resolving the contradiction between target area and durability.
2Area of stationary object
If multiple targets are positioned in a conventional PVD chamber, then the deposition area is improved, but the film uniformity deteriorates
Solution Approach 1:
The patent employs a movable/oscillating target mechanism that dynamically adjusts the target position during deposition. This dynamic positioning ensures uniform material distribution across the substrate surface, maintaining film uniformity while enabling coverage of large areas through multiple targets.
3Area of stationary object
If large-area monolithic targets are manufactured, then the substrate coverage is improved, but the manufacturing difficulty and cost increase
Solution Approach 1:
The patent segments large-area targets into smaller modular units that are easier to manufacture with consistent material properties. These modular targets can be independently fabricated and assembled, significantly reducing manufacturing difficulty and cost while achieving the required coverage area.
4Manufacturing precision
If conventional PVD chambers are designed for single large target, then the target-to-substrate fit is improved, but the throughput decreases
Solution Approach 1:
The patent uses multiple smaller targets instead of a single large target, allowing parallel processing capability. This segmentation enables higher throughput by processing multiple substrate areas simultaneously or by enabling faster target replacement and reconfiguration.
Solution Approach 2:
The patent incorporates movable and oscillating target mechanisms that enable flexible positioning and rapid reconfiguration for different substrate sizes and shapes. This dynamic capability maintains precise target-to-substrate alignment while improving throughput through adaptive processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances film uniformity, reduces material costs, increases throughput, and allows for adjustable film composition, while managing defects and extending target life by ensuring full-face erosion and controlled film thickness across the substrate.
Implementation Method 1
The magnet array applies an external magnetic field that traps electrons and confines the plasma close to the target
Implementation Method 2
The high voltage generates an electric field inside the PVD chamber that is used to enable sputtering of the target material and generate and emit electrons from the target
Implementation Method 3
The plasma may include argon atoms, positively charged argon ions, free electrons, and ionized and neutral metal atoms sputtered from the target
Implementation Method 4
The argon ions are accelerated towards the target due to the negative bias and collide with a surface of the target causing atoms of the target material to be ejected therefrom
Implementation Method 5
The first target comprises one or more cooling channels configured to receive a coolant therethrough for cooling the first target
Data Source
AI summary
Apparatus and methods for improving film uniformity in a physical vapor deposition (PVD) process are provided herein. In some embodiments, a PVD chamber includes a pedestal disposed within a processing region of the PVD chamber, the pedestal having an upper surface configured to support a substrate thereon, a first motor coupled to the pedestal, a lid assembly comprising a first target, a first magnetron disposed over a portion of the first target, and in a region of the lid assembly that is maintained at atmospheric pressure, a first actuator configured to translate the first magnetron in a first direction, a second actuator configured to translate the first magnetron in a second direction, and a system controller that is configured to cause the first magnetron to translate along at least a portion of a first path by causing the first actuator and second actuator to simultaneously translate the first magnetron.