Tilted Wafer Pod Transfer Assembly for Vibration Stability
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Solution Overview
Problem
Semiconductor wafers are prone to mispositioning and breakage during transportation and processing due to vibrations, leading to increased costs and reduced yield in semiconductor device manufacturing.
Innovation Solution
A wafer pod transfer assembly with a tilt assembly that tilts the wafer pod upwardly and rearwardly, combined with a pin locking mechanism to secure the shaft and prevent leaning, ensuring stable and secure positioning and movement of wafers within the wafer pod transfer assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wafers are transported in a standard horizontal position, then transportation is simple and direct, but wafers are prone to mispositioning and breakage due to vibrations
Solution Approach 1:
The patent introduces a tilt dimension to the wafer pod transportation system. The wafer pod is tilted at an angle (e.g., 15-45 degrees) relative to the horizontal plane during transportation. This dimensional change causes wafers to settle against the rear wall of the pod due to gravity, preventing mispositioning and breakage from vibrations while maintaining a relatively simple transportation mechanism.
2Reliability
If a tilt assembly is introduced to prevent wafer mispositioning, then wafer stability improves, but the device complexity increases
Solution Approach 1:
The tilt assembly functions as a passive counterbalance mechanism. By tilting the wafer pod, gravity naturally acts as a stabilizing force that presses wafers against the rear wall, eliminating the need for active vibration damping systems or complex positioning mechanisms. The shaft receiver with pin and groove features provides mechanical support without requiring additional active control systems.
Solution Approach 2:
The tilt assembly creates a gravitational potential gradient along the wafer stacking direction. Wafers are positioned in a tilted configuration where gravity provides a constant stabilizing force, effectively creating an equipotential state for wafer positioning that prevents movement during transportation without requiring active control.
3Manufacturing precision
If a pin locking mechanism is added to secure the shaft, then positioning precision improves, but manufacturing complexity increases
Solution Approach 1:
The pin locking mechanism is designed as a self-securing system. The pin fits into a groove feature on the shaft, and the shaft receiver includes a groove that receives the pin. This self-locking mechanical interface provides precise shaft positioning without requiring additional fasteners, adjustment mechanisms, or complex assembly procedures. The design leverages the inherent geometry of the components to achieve both precision and ease of manufacture.
Data Source
AI summary
A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.