Tilting Wafer Carrier Assembly for Backlash-Free Positioning
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Solution Overview
Problem
Existing wafer carrier assemblies restrict wafer processability due to partial coverage or hidden edges, require manual unlocking for automation, and have complex mechanisms that limit efficiency and space in fully automated processing systems.
Innovation Solution
A carrier assembly with a tilting mechanism that allows for play-free positioning of wafers, enabling side positioning and ensuring repeatability and stability during processing, while allowing for fully automated operation and compatibility with high-vacuum applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex clamping mechanisms are used to hold the wafer, then the wafer can be securely positioned, but the device complexity increases and space is reduced
Solution Approach 1:
The positioning system is segmented into a fixed carrier body and a movable positioning part that can be tilted between positions. This segmentation allows the positioning function to be achieved with simpler components rather than a complex integrated clamping mechanism.
Solution Approach 2:
The positioning part is made dynamic through the tilting mechanism, allowing it to switch between a first position (for wafer insertion/removal) and a second position (for secure positioning). This dynamic adjustment replaces the need for complex multi-component clamping mechanisms.
2Reliability
If the carrier partially covers the wafer to hold it, then the wafer is secured, but the surface area available for processing is reduced
Solution Approach 1:
Instead of covering the wafer surface in the horizontal plane, the positioning part extends in the vertical dimension and uses lateral positioning. The positioning surface contacts the wafer from the side, allowing the top surface to remain fully accessible for processing while still achieving secure holding.
3Ease of operation
If manual unlocking mechanisms are used, then the carrier can be operated, but automation capability is limited
Solution Approach 1:
The tilting mechanism is designed to be actuated by the wafer itself during insertion and removal. When the wafer is placed on the carrier, its weight automatically tilts the positioning part to the first position, enabling loading without manual intervention. Similarly, during removal, the positioning part automatically tilts to facilitate wafer ejection.
4Manufacturing precision
If sliding positioning mechanisms are used, then the wafer can be positioned, but friction is high and vacuum compatibility is reduced
Solution Approach 1:
The sliding friction-based positioning mechanism is replaced with a tilting/pivoting mechanism. The positioning part rotates around a pivot point, replacing high-friction sliding contact with lower-friction rotational movement, making the system suitable for vacuum environments where minimal friction is critical.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables fully automated, efficient, and repeatable processing of wafers without play, maximizing surface accessibility and processing efficiency, and accommodating both automated and manual operation in various environments.
Implementation Method 1
The tilting mechanism involves pivoting or tilting around an axis, i.e., a pivotable or tiltable bearing. This type of bearing exhibits significantly lower friction compared to a plain bearing.
Data Source
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AI summary
The invention relates to a carrier assembly (24) for backlash-free positioning of a wafer (22), comprising a carrier (26) for the wafer (22), a tilting mechanism (40), and a positioning element (34). The carrier (26) has an opening (30) for receiving the wafer (22). The positioning element (34) has a positioning surface (36) for laterally positioning the wafer (22). The tilting mechanism (40) is configured to tilt the positioning element (34) between a release position and a positioning position in which the wafer (22) is positioned between an edge of the opening (30) and the positioning surface (36). Furthermore, the invention relates to a system (10) and a method for backlash-free positioning of a wafer or for removing a wafer from a carrier.