Mechanical TIM Cooling Structure for PCB Leakage Control

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Heat-producing electronic components on Printed Circuit Boards (PCBs) require cooling, but existing thermal interface materials (TIMs) often leak onto sensitive components, reducing their performance.

Innovation Solution

A mechanical device with an aperture and supports is used to apply TIM, aligning it with the electronic component while preventing leakage onto the PCB, utilizing a material with greater thermal conductivity than the PCB to enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal interface material is applied to the heat-producing electronic component, then heat dissipation is improved, but the TIM may leak onto the PCB and cover sensitive components, reducing their performance

Engineering Contradiction:

Improveheat dissipationVSAvoidTIM leakage onto PCB

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The device divides the TIM application area into segments using an aperture that is smaller than the electronic component surface. This segmentation confines the TIM to specific regions through the aperture opening, preventing uncontrolled spread across the entire component surface and onto the PCB.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The device applies TIM with localized precision through the aperture, which has specific dimensions and shape characteristics. This local quality approach ensures TIM is applied only where needed for heat dissipation while preventing leakage to sensitive areas, creating different TIM distribution zones on the electronic component surface.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If the aperture area is reduced to prevent TIM leakage, then TIM containment is improved, but the heat dissipation efficiency may be reduced

Engineering Contradiction:

ImproveTIM leakage preventionVSAvoidheat dissipation efficiency

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The device optimizes the aperture parameters (area, shape, position) to achieve a balance between TIM containment and heat dissipation efficiency. The aperture dimensions are specifically designed to be smaller than the electronic component surface area, creating optimal conditions for both preventing TIM leakage and maintaining effective thermal contact.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device effectively applies TIM to electronic components without covering sensitive areas, ensuring efficient heat dissipation and preventing unintended leakage, thereby maintaining the performance of high-speed signal paths.

Implementation Method 1

a thermal interface material (TIM) disposed within the aperture of the device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11910573B2Mechanical device for cooling an electronic component

Publication Date: 2024.02.20 MELLANOX TECHNOLOGIES LTD(IL)

AI summary

A mechanical device for cooling an electronic component may include a surface including an aperture, and a first support protruding from the surface and a second support protruding from the surface. In some embodiments, the device may include disposed within the aperture a thermal interface material (TIM).