Thermal Interface Material Testing for Evaporation and Corrosion
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Solution Overview
Problem
Current thermal interface materials (TIMs) used in integrated circuit testing face issues such as evaporation, corrosion, and inadequate thermal performance, leading to production delays and recalls, necessitating improved evaluation methods to ensure reliable service.
Innovation Solution
A test methodology and configuration involving temperature sensors and current measurement devices to assess the thermal performance and evaporation of TIMs, ensuring adequate coverage and preventing corrosion by monitoring temperature and current changes during testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water-based thermal interface material is used to improve thermal performance, then thermal contact is enhanced, but evaporation occurs at high test temperatures and corrosion happens on C4 connects
Solution Approach 1:
The patent changes the chemical composition parameters of the thermal interface material by formulating a specific ratio of water (70-90%) to non-corrosive additive (10-30%), transforming it from a purely water-based material to a modified composition that maintains thermal performance while eliminating evaporation and corrosion issues
Solution Approach 2:
The patent creates a composite thermal interface material by combining water with non-corrosive additives such as propylene glycol, glycerin, or alcohol, resulting in a hybrid material that inherits the high thermal conductivity of water while gaining the non-corrosive and non-evaporating properties of the additive
2Reliability
If alternative interface materials like PAO oil or thermal grease are used to avoid evaporation and corrosion, then reliability improves, but cleaning with solvent is required after test
Solution Approach 1:
The patent develops a thermal interface material that is designed to be easily removable without requiring harsh cleaning solvents, allowing the material to be applied and then simply wiped or washed off with water, eliminating the need for complex cleaning procedures
3Ease of operation
If thermal pads are used instead of liquid materials, then ease of application improves, but thermal performance is insufficient and residue is left behind
Solution Approach 1:
The patent utilizes the fluidity and wetting properties of liquid-based thermal interface materials to achieve superior thermal contact, allowing the material to flow into and fill surface irregularities between the chip and heat sink, creating a more effective thermal pathway than rigid thermal pads
4Temperature
If liquid metals or soft metals are used to achieve very good thermal performance, then thermal contact improves, but oxidation occurs over time and repeated reuse causes damage to heat sinks and unreliable contact
Solution Approach 1:
The patent creates a chemically inert thermal interface material environment by using water combined with non-corrosive additives, which does not oxidize or react with the heat sink or chip surfaces, providing stable, long-lasting thermal performance without the degradation issues of liquid metals
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively evaluates TIMs for their ability to maintain thermal performance without evaporation or corrosion, reducing production delays and ensuring reliable service by identifying suitable materials through controlled testing conditions.
Implementation Method 1
determining an evaporation of a thermal interface material between the device under test and the heat sink by sensing a temperature rise above a steady state temperature
Implementation Method 2
the heat sink is brought into contact with the chip... the heat sink is removed
Implementation Method 3
Power is applied to the test device... circuits can be tested at power levels in excess of 400 watts, which consequently generates a tremendous amount of heat build-up
Data Source
AI summary
Methodologies and test configurations are provided for testing thermal interface materials and, in particular, methodologies and test configurations are provided for testing thermal interface materials used for testing integrated circuits. A test methodology includes applying a thermal interface material on a device under test. The test methodology further includes monitoring the device under test with a plurality of temperature sensors. The test methodology further includes determining whether any of the plurality of temperature sensors increases above a steady state.