Integrated TIM-on-Die Packaging for Low-Profile Heat Conduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current heat conduction schemes for semiconductor controllers, such as mounting a heat sink on top of the mold compound, add height to the overall controller and are not very effective at removing heat, especially for high-speed graphics processing units and AI processing units.
Innovation Solution
Integrating a thermal interface material (TIM) layer on top of the controller semiconductor die, which is then encapsulated within a mold compound, allowing the TIM layer to be exposed on the upper surface for efficient heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is mounted on top of the mold compound to draw heat away from the controller, then heat removal is attempted, but the overall height of the controller increases and heat removal effectiveness is insufficient
Solution Approach 1:
The patent combines the thermal interface material layer with the controller die structure itself, integrating the heat conduction function directly into the controller assembly rather than adding a separate heat sink component on top of the mold compound. This merging approach improves heat removal effectiveness while avoiding the height penalty of external heat sinks.
Solution Approach 2:
The patent transitions from a vertical heat dissipation approach (heat sink mounted on top of mold compound) to a horizontal/integrated approach where the TIM layer is positioned between the controller die and the mold compound, allowing heat to conduct through the mold compound in a different dimensional path without increasing overall height.
2Loss of energy
If a heat sink is mounted on top of the mold compound, then heat conduction is attempted, but the heat conduction effectiveness is not sufficient for high-speed graphics processing units and AI processing units
Solution Approach 1:
The patent introduces a thermal interface material layer as an intermediary between the controller die and the mold compound. This TIM layer serves as a specialized mediator that improves thermal coupling and heat conduction effectiveness, addressing the insufficient heat removal of conventional direct mounting approaches without requiring complex active cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The TIM layer provides effective heat conduction away from the controller die while maintaining a low profile, enhancing thermal management without increasing the overall height of the semiconductor controller.
Implementation Method 1
the TIM layer configured to conduct heat away from the controller semiconductor die
Data Source
AI summary
A semiconductor controller includes a controller semiconductor die having an integrated thermal interface material layer, or TIM formed on top of the die. In embodiments, the controller semiconductor die may be mounted on a substrate, for example in a flip-chip configuration. Thereafter, the TIM may be positioned on an upper surface of the controller semiconductor die and the TIM and controller semiconductor die may be positioned within a mold chase for encapsulation in mold compound. After encapsulation, the TIM may be exposed in an upper surface of the encapsulated controller semiconductor die.