Semiconductor Package TIM Patterns for Vertical Heat Dissipation
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Solution Overview
Problem
The excessive heat generated by semiconductor chips in a package can degrade the performance of the semiconductor package due to inadequate thermal management.
Innovation Solution
A semiconductor package design that includes thermal interfacial material patterns and a non-metal thermal conductive layer, where the thermal conductivity in the horizontal direction is lower than in the vertical direction, to manage heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interfacial material patterns and non-metal thermal conductive layers are used to dissipate heat vertically, then heat dissipation performance is improved, but thermal conduction between adjacent chips increases
Solution Approach 1:
The patent applies local quality by creating thermal interfacial material patterns with spatially varying thermal conductivity. The non-metal thermal conductive layer has higher thermal conductivity in the vertical direction (for heat dissipation) and lower thermal conductivity in the horizontal direction (to prevent thermal conduction between chips). This anisotropic thermal conductivity distribution allows different regions and directions to have optimized thermal properties for their specific functions.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the non-metal thermal conductive layer to achieve anisotropic thermal management. By controlling the thermal conductivity values in different directions (vertical vs. horizontal), the system optimizes heat dissipation while preventing unwanted thermal coupling between adjacent semiconductor chips.
2Adaptability or versatility
If multiple semiconductor chips are packaged together to increase functionality, then system integration is improved, but heat generation and thermal management complexity increase
Solution Approach 1:
The patent segments the thermal management system into distinct functional components: thermal interfacial material patterns between chips and a non-metal thermal conductive layer. This segmentation allows independent optimization of thermal pathways - vertical pathways for heat dissipation and horizontal pathways for thermal isolation - thereby managing heat from multiple chips without requiring complex integrated thermal management systems.
Solution Approach 2:
The non-metal thermal conductive layer acts as an intermediary between adjacent semiconductor chips. It mediates the thermal interaction by providing controlled thermal conductivity in specific directions, enabling heat dissipation from each chip while preventing thermal conduction between chips, thus simplifying the overall thermal management of multi-chip packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces thermal conduction between semiconductor chips and prevents performance degradation by optimizing heat dissipation through the use of thermal interfacial materials and non-metal thermal conductive layers.
Implementation Method 1
a thermal conductivity of the first non-metal thermal conductive layer in the horizontal direction is lower than a thermal conductivity of the first non-metal thermal conductive layer in the vertical direction
Data Source
AI summary
A semiconductor package includes: a first semiconductor chip disposed on a package substrate; a second semiconductor chip adjacent to the first semiconductor chip in a horizontal direction and disposed on the package substrate; a plurality of first thermal interfacial material patterns overlapping the first semiconductor chip in a vertical direction; a plurality of second thermal interfacial material patterns overlapping the second semiconductor chip in the vertical direction; and a first non-metal thermal conductive layer disposed between the plurality of first thermal interfacial material patterns, wherein the plurality of first thermal interfacial materials are spaced apart from the plurality of second thermal interfacial materials in the horizontal direction, and a thermal conductivity of the first non-metal thermal conductive layer in the horizontal direction is lower than a thermal conductivity of the first non-metal thermal conductive layer in the vertical direction.