Protector Cap for Thermal Interface Material Scratch Protection

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional electronic component packages face limitations in thermal insulation and reliability due to the vulnerability of thermal interface materials (TIMs) to mechanical damage, such as scratching, which hampers efficient heat dissipation and operational performance.

Innovation Solution

A package design featuring an electrically conductive carrier with an encapsulant and an electrically insulating, thermally conductive interface structure, protected by a removable protection cap that can be slid over the interface structure to prevent mechanical damage, ensuring efficient heat removal and dielectric decoupling while maintaining the interface structure's integrity until it is exposed for use.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal interface material is exposed for heat dissipation, then thermal conductivity is improved, but mechanical strength deteriorates due to susceptibility to scratching and damage

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmechanical robustness of interface structure

Core Design Contradiction:

TemperatureVSStrength

Solution Approach 1:

The package is divided into separate functional components: the interface structure for thermal conduction and the protection cap for mechanical strength. This segmentation allows each component to optimize its specific function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The protection cap acts as an intermediary element that temporarily covers the interface structure during handling and transport. It mediates between the need for mechanical protection and the requirement for thermal contact, being removable when thermal dissipation is needed.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If protection cap is added to protect interface structure, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improvepackage reliabilityVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The protection cap is designed as a simple, inexpensive, and easily removable component. It serves its protective function during critical phases (handling, transport, storage) and can be discarded or set aside when no longer needed, without adding permanent complexity to the package.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The protection cap employs a simple shell structure that provides adequate mechanical protection without requiring complex mechanisms. This flexible approach to protection minimizes added complexity while maintaining reliability.

Inventive Principle:

Principle #30Flexible shells and thin films

3Strength

If interface structure is covered permanently, then mechanical strength is improved, but heat dissipation deteriorates due to thermal insulation

Engineering Contradiction:

Improvemechanical protection of interface structureVSAvoidheat dissipation efficiency

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The protection cap is designed to be dynamically removable rather than permanently fixed. This allows the system to transition between protected state (during handling) and operational state (during use), adapting to different functional requirements without permanent compromise to thermal performance.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a mechanically robust and reliable package with enhanced thermal and electrical reliability by protecting the sensitive interface structure from mechanical damage, allowing for efficient heat dissipation and preventing undesired electrical paths, thus improving the package's overall performance and longevity.

Implementation Method 1

an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 3

a protection cap partially or entirely covering the interface structure

Methodology Applied

Scientific EffectMechanical protection: Physical Containment

Data Source

PatentUS11769701B2Protector cap for package with thermal interface material

Publication Date: 2023.09.26 INFINEON TECH AUSTRIA AG

AI summary

A package includes an electrically conductive carrier, an electronic component on the carrier, an encapsulant encapsulating part of the carrier and the electronic component, an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier, and a protection cap covering at least part of the interface structure. Corresponding methods of manufacturing and operating the package are also described.