Thermal Interface Layer and Through-Hole Plate for Package Cooling
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Solution Overview
Problem
The increasing heat generated by miniaturized and high-performance electronic products poses a challenge in developing effective heat dissipation solutions.
Innovation Solution
The electronic device incorporates a substrate with semiconductor packages and thermal interface material layers, where the thermal interface material layers are disposed between the semiconductor packages and a plate with through-holes, allowing for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface material layers are disposed between semiconductor packages and a plate to improve heat dissipation, then heat dissipation characteristics are enhanced, but device complexity increases due to additional components and assembly steps
Solution Approach 1:
The patent combines multiple functions into the plate structure: the plate serves as both a structural support component and a heat dissipation component with integrated through-holes. The thermal interface material layers are strategically positioned to simultaneously fill gaps between components and conduct heat through the plate's through-holes, merging mechanical support and thermal management functions into a unified structure.
Solution Approach 2:
The plate is segmented with multiple through-holes that divide the heat dissipation path into discrete channels. This segmentation allows heat to be conducted through multiple separate pathways simultaneously, improving overall heat dissipation efficiency while maintaining a relatively simple single-plate structure rather than requiring multiple separate heat sinks.
2Productivity
If miniaturization and high performance are pursued to increase product functionality, then productivity and performance are improved, but heat generation increases creating thermal management challenges
Solution Approach 1:
The patent transitions from traditional planar heat dissipation to three-dimensional heat management by utilizing through-holes that extend vertically through the plate. This dimensional change creates additional heat conduction pathways in the vertical direction, allowing heat to be dissipated more effectively from miniaturized high-performance components that generate concentrated heat in small volumes.
Solution Approach 2:
The thermal interface material layers act as intermediary substances between the semiconductor packages and the plate's through-holes. These materials facilitate efficient heat transfer from the components to the heat dissipation pathways, enabling high-performance miniaturized components to be managed thermally without requiring direct contact between components and the plate structure.
3Temperature
If thermal interface material layers fill through-holes and contact both semiconductor packages and plate, then heat dissipation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The plate's through-holes are pre-formed with specific dimensions and positions before assembly. The thermal interface material layers are designed to be applied in advance or during assembly in a way that ensures they will fill the through-holes and make contact with both the semiconductor packages and plate surfaces. This preliminary preparation of the heat dissipation pathways reduces the need for complex post-assembly adjustments and maintains reasonable manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation characteristics by allowing the thermal interface material layers to fill through-holes and contact both the semiconductor packages and the plate, effectively managing heat generated by the electronic device.
Implementation Method 1
a first thermal interface material layer disposed between the first semiconductor package and the first plate, contacting an upper surface of the first semiconductor package and the first internal surface of the first plate
Data Source
AI summary
An electronic device includes a substrate, a first plate having a first internal surface facing a first surface of the substrate, and at least one first through-hole and at least one second through-hole, first and second semiconductor packages spaced apart from each other between the first surface and the first internal surface, a first thermal interface material layer contacting an upper surface of the first semiconductor package and the first internal surface, and filling at least a portion of the at least one first through-hole, and a second thermal interface material layer contacting an upper surface of the second semiconductor package and the first internal surface, and filling at least a portion of the at least one second through-hole. At least one of side surfaces of the first and second thermal interface material layers is exposed to an empty space between the first internal surface and the first surface.