Balancing Timing Sensitivities for IC Closure
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in achieving timing closure due to environmental and process variations, leading to increased product development times and uncompetitive products, as simple guard-banding methods are insufficient to address the complexities of correlated and uncorrelated variations.
Innovation Solution
A method that measures the performance of embedded devices within semiconductor products, calculates sensitivities to correlated parameters, and balances these sensitivities using an extended canonical model to shift timing degradation from one parameter to another, allowing for more precise adjustments and reduced guard-banding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If simple guard-banding is used to address variations, then timing closure is achieved, but product development time increases and products become uncompetitive
Solution Approach 1:
The patent applies parameter changes by transitioning from simple guard-banding to a sophisticated sensitivity balancing approach that dynamically adjusts timing models based on correlated and uncorrelated variations. The system calculates sensitivities to multiple parameters (e.g., voltage, temperature, process variations) and balances them to achieve more precise timing closure without excessive guard-banding, thereby reducing product development time while maintaining reliability.
Solution Approach 2:
The patent implements feedback mechanisms by measuring the performance of embedded devices within semiconductor products and using these measurements to refine timing models. The system continuously monitors timing degradation and adjusts sensitivity balances accordingly, creating a closed-loop approach that improves timing closure efficiency and reduces the need for conservative guard-banding.
2Reliability
If sensitivity balancing is implemented, then timing degradation is reduced, but measurement and calculation complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the sensitivity analysis into distinct components: correlated variations (systematic across die, wafers, or lots) and uncorrelated variations (random). The system separately characterizes and extracts these variation types using specialized timing models, then combines them through sensitivity balancing. This segmentation reduces overall complexity by making the analysis more manageable and systematic.
Solution Approach 2:
The patent uses an extended canonical model as an intermediary that bridges the gap between raw performance measurements and final timing closure. This model serves as a mediator that processes sensitivity calculations and translates them into actionable timing adjustments, reducing the direct complexity of measuring and calculating all variation effects simultaneously.
3Measurement precision
If correlated and uncorrelated variations are fully characterized, then timing precision improves, but processing requirements and development time increase
Solution Approach 1:
The patent applies partial action by selectively characterizing and extracting variations based on their impact levels. Rather than fully characterizing all possible variations, the system identifies and focuses on the most significant correlated and uncorrelated variation sources that affect timing closure. This partial characterization approach achieves sufficient timing precision while reducing processing requirements and development time.
Data Source
AI summary
Systems and methods for improving timing closure of new and existing semiconductor products by balancing sensitivities. More specifically, a method is provided for that includes defining at least one set of correlated parameters for a semiconductor product, the at least one set of correlated parameters comprising a first parameter and a second parameter. The method further includes measuring performance of embedded devices within the semiconductor product. The method further includes closing timing of the semiconductor product using the measured performance of the semiconductor product. The closing the timing of the semiconductor product comprises calculating a sensitivity to the first parameter based on the measured performance of the embedded devices within the semiconductor product and balancing the sensitivity to the first parameter with a sensitivity to a second parameter such that timing degradation is shifted from the first parameter to the second parameter.