Flexible Substrate Manufacturing Using Tin Adhesive Phase Transition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing of flexible display apparatuses is challenging due to the flexible characteristics of substrates, which can lead to misalignment in photolithography and mask processes, resulting in manufacturing defects.
Innovation Solution
A method involving a rigid carrier with an intermediate adhesive layer containing transformative material, such as metallic tin, which disintegrates under stress, allowing for stable handling and easy separation of the flexible substrate during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a flexible substrate is used directly during manufacturing, then the final product achieves flexible characteristics, but handling and processing becomes difficult due to substrate flexibility causing misalignment
Solution Approach 1:
A rigid carrier serves as an intermediary support during manufacturing processes, providing mechanical stability and preventing substrate deformation. The carrier acts as a mediator that enables precise handling and alignment while the substrate is being processed, then is removed to leave the flexible substrate intact.
Solution Approach 2:
The manufacturing process is segmented into two distinct phases: first, processing on a rigid carrier where precision is critical; second, transfer to the flexible substrate where flexibility is utilized. This segmentation allows each phase to optimize for its specific requirements without compromise.
2Manufacturing precision
If a rigid carrier is used to support the flexible substrate during processing, then handling and alignment are improved, but separation of the substrate from the carrier becomes difficult
Solution Approach 1:
The adhesive layer utilizes phase transition of tin material, which changes from a bonded state during processing to a disintegrated state during separation. This phase transition enables the adhesive to provide strong bonding during manufacturing, then easily release the substrate when separation is required, resolving the contradiction between secure attachment and easy separation.
3Stability of the object's composition
If a strong adhesive layer is used to secure the flexible substrate on the carrier, then the substrate remains stable during processing, but separation requires excessive force that may damage the substrate
Solution Approach 1:
The adhesive layer's phase transition capability allows it to exhibit strong adhesion during processing (stable composition) and weak adhesion during separation (reduced strength requirement). The tin material transitions between bonded and disintegrated phases, enabling both stable attachment and gentle separation without substrate damage.
Solution Approach 2:
The adhesive properties of the layer are changed by modifying the physical state of the tin material through temperature or stress parameters. During processing, parameters are set to maximize adhesion strength; during separation, parameters are adjusted to reduce adhesion strength, allowing easy substrate removal without damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise handling and processing of flexible substrates without defects, as the adhesive layer remains intact during processing and disintegrates for non-destructive separation, reducing manufacturing errors and costs.
Implementation Method 1
the intermediate adhesive layer includes transformative material that disintegrates when subject to disintegration stresses. Yet more specifically, the transformative material can be a metallic tin (Beta Sn) which is convertible into a nonmetallic tin (Alpha Sn) when subjected to transformative stresses (disintegration stresses)
Data Source
AI summary
Provided are a method for manufacturing a flexible display apparatus, which allows for easy separation of a flexible substrate from its supporting carrier as well as allowing easy handling of the flexible substrate during processing of the flexible substrate while it is on its supporting carrier. Also provided is a flexible display apparatus manufactured by the method. The method includes forming an adhesive layer including a metallic tin where the adhesive layer is disposed on a supportive carrier and disposing a flexible substrate on the adhesive layer such that the flexible substrate is affixed to the supporting carrier with the adhesive layer interposed therebetween. The method further includes separating the flexible substrate from the carrier by transformatively stressing (disintegration-wise stressing) the adhesive layer for example by means of temperature lowering.


