Tin Alloy Separation Layer for Flexible Substrate Release

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current methods for separating flexible electronic substrates from rigid substrates, such as laser irradiation and chemical solutions, are inefficient and can damage the substrates and devices, affecting the performance of flexible electronic devices.

Innovation Solution

A manufacturing method involving a film-form separation layer made of tin or tin alloys, which is processed to crack from a film form into a powder form, allowing for the separation of substrates without high-energy stimuli, thereby reducing damage to the substrates and devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If laser irradiation or chemical solutions are used to separate the flexible substrate from the rigid substrate, then the separation can be achieved, but the substrates and devices may be damaged, affecting performance

Engineering Contradiction:

Improvesubstrate and device integrityVSAvoidseparation process complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

A separation layer is formed between the flexible substrate and rigid substrate before the flexible substrate is manufactured. This preliminary structure enables non-destructive separation later without requiring high-energy laser irradiation or chemical solutions that could damage the substrates or devices.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The separation layer acts as an intermediary substance between the flexible substrate and rigid substrate. It facilitates easy separation through physical cracking when cooled below 13.2°C, avoiding the need for harmful separation methods while maintaining substrate integrity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If high-energy laser irradiation is used to separate substrates, then separation can be achieved, but production efficiency decreases and costs increase due to potential damage

Engineering Contradiction:

Improveproduction efficiencyVSAvoidsubstrate and device damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The separation layer utilizes the phase transition of tin from white tin to gray tin when cooled below 13.2°C. This phase change causes the separation layer to crack and separate automatically, providing a low-energy, efficient separation method that avoids substrate damage and improves production efficiency.

Inventive Principle:

Principle #36Phase transitions

Solution Approach 2:

The patent replaces high-energy mechanical systems (laser irradiation) with a thermal-based phase transition mechanism. By cooling the separation layer below its transformation temperature, the tin undergoes phase change and cracks, achieving separation without the harmful effects of high-energy laser irradiation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If a film-form separation layer is used, then substrate separation is enabled, but the separation layer must be processed to crack from film form

Engineering Contradiction:

Improveseparation process simplicityVSAvoidseparation layer structure

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The separation layer's physical state is changed by adjusting temperature parameters. When cooled below 13.2°C, the tin-based separation layer transforms from a continuous film form to a cracked state, enabling simple separation without complex processing steps while maintaining ease of manufacture.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances production efficiency and reduces costs while minimizing damage to the substrates and devices, ensuring the performance of flexible electronic devices.

Implementation Method 1

the separation layer comprises one or more selected from the group consisting of tin and a tin alloy... transforming the tin from white tin to gray tin... cooling the separation layer below 13.2 degrees Celsius

Methodology Applied

Scientific EffectPhase transition (allotropic transformation): Phase Change

Data Source

PatentUS11529802B2Manufacturing method of flexible electronic substrate and substrate structure

Publication Date: 2022.12.20 BEIJING BOE TECH DEV CO LTD

AI summary

A manufacturing method of a flexible electronic substrate and a substrate structure are disclosed. The manufacturing method includes: providing a first substrate comprising a first surface and a second surface which are opposite; forming a separation layer on the first surface of the first substrate, the separation layer being in a film form; providing a second substrate on the separation layer, the second substrate being configured as a flexible substrate; and processing the separation layer, such that at least a part of the separation layer is cracked from the film form, thereby separating the second substrate from the first substrate.