Tin-Based Bonding Material for Flexible Carbon Joints
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Solution Overview
Problem
Existing bonding materials face challenges in bonding carbon materials of varying shapes due to particulate form requirements and result in poor flexibility and high stress, leading to potential cracking, especially when using high Young modulus insert materials like silver, copper, and titanium.
Innovation Solution
A bonding material comprising 0.1 wt% to 5 wt% of compound-formable elements such as titanium, zirconium, or vanadium, primarily tin, which forms a compound layer with carbon, enabling flexible bonding with high tensile strength and maintaining heat conductivity by controlling the compound layer's thickness and composition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high Young modulus insert materials (silver, copper, titanium) are used for bonding, then bonding strength is improved, but flexibility deteriorates and stress increases leading to cracking
Solution Approach 1:
The invention changes the material parameters by using low melting point metal (melting point 100°C to 500°C) instead of high Young modulus materials. This parameter change enables the bonding material to soften at low temperatures, providing flexibility while maintaining bonding strength through controlled compound layer formation.
Solution Approach 2:
The invention creates a composite structure with a compound layer formed between the bonding material and carbon material. This composite approach combines the low melting point metal with carbon-containing compounds, achieving both flexibility from the soft metal matrix and bonding strength from the interfacial compound layer.
2Strength
If conventional bonding materials are used, then bonding is achieved, but flexibility of the bonded structure deteriorates
Solution Approach 1:
The invention fundamentally changes the thermal and mechanical parameters of the bonding material by selecting metals with melting points between 100°C and 500°C. This allows the material to remain soft and flexible at room temperature while still providing strong bonding through low-temperature processing and compound layer formation.
Solution Approach 2:
The bonding material acts as a flexible interlayer between carbon materials, similar to how flexible films provide both bonding and flexibility. The low melting point metal creates a compliant bonding interface that accommodates deformation while maintaining structural integrity.
3Strength
If carbon particles are used in bonding material, then bonding to carbon material is achieved, but flexibility deteriorates due to particulate form requirements
Solution Approach 1:
The invention changes the physical state parameter of carbon in the bonding material from particulate (solid) to gaseous (carbon-containing gas). This allows the carbon to be uniformly distributed in the metal matrix without creating rigid particulate structures, maintaining both bonding capability and flexibility.
Solution Approach 2:
The invention uses carbon-containing gases (such as methane, acetylene, or carbon monoxide) instead of solid carbon particles. This pneumatic approach allows carbon to be introduced in a flexible gaseous state that can be uniformly distributed throughout the bonding material without compromising flexibility.
4Strength
If high temperature baking (1700°C to 2100°C) is used for bonding, then bonding strength is improved, but manufacturing complexity and energy consumption increase
Solution Approach 1:
The invention dramatically changes the temperature parameter from extreme high temperature (1700°C to 2100°C) to low temperature (100°C to 500°C melting point range). This parameter change reduces energy consumption while still achieving strong bonding through the formation of compound layers at the lower temperature.
Solution Approach 2:
The invention utilizes the phase transition (melting) of low melting point metals as the bonding mechanism. By heating to the melting point of the bonding metal (100°C to 500°C) rather than extreme temperatures, the material softens and forms strong bonds, then solidifies upon cooling to create a rigid but flexible joint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a flexible and strong bond between carbon materials, reducing the risk of cracking and maintaining heat conductivity, suitable for various applications including heat spreaders and semiconductor components.
Implementation Method 1
a compound layer which includes a compound of the compound-formable element, tin, and carbon is formed at an interface between the bonding material and the carbon material
Implementation Method 2
maintaining heat conductivity by controlling the compound layer's thickness and composition
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3
AI summary
A bonding material includes at least 0.1 wt% to at most 5 wt% of at least one element which may form a compound along with tin and carbon, and Sn as the main component of a remainder.