Alternating Tin Copper Tie Seed Layer Plated Polymeric Article
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Solution Overview
Problem
Conventional metal plating technologies, such as copper plating, have limitations in applications requiring high electrical conductivity and corrosion resistance with a lower melting point, as pure copper's high melting point makes it unsuitable for certain applications like lightning protection.
Innovation Solution
The use of a tie/seed layer comprising alternating sputter-coated layers of tin and copper on a polymeric substrate, with a plated metal layer that can be either a bronze alloy or an alternating tin-copper structure, to achieve high conductivity and corrosion resistance while reducing the melting point, typically below 800°C.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pure copper plating is used, then high electrical conductivity is achieved, but the melting point is too high for certain applications like lightning protection
Solution Approach 1:
The patent applies composite materials by creating a multi-layer plated structure consisting of alternating copper and tin layers. The copper layers provide high electrical conductivity while the tin layers lower the overall melting point of the plated article. This composite layered structure combines the beneficial properties of both metals to resolve the contradiction between maintaining high conductivity and reducing melting point for lightning protection applications.
Solution Approach 2:
The patent implements local quality by creating alternating layers of copper and tin with specific thicknesses (copper layers 0.5-5.0 μm, tin layers 0.5-2.0 μm). The copper-rich regions maintain high electrical conductivity while the tin-rich regions contribute to lower melting point. This localized distribution of different material properties within the plated structure allows simultaneous optimization of both conductivity and melting characteristics.
2Reliability
If alternating tin and copper layers are used, then melting point is reduced and corrosion resistance is improved, but the plating structure becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the plated structure into multiple alternating layers of copper and tin instead of using a single uniform layer. This segmented layered structure provides several benefits: each layer can be optimized for its specific function (copper for conductivity, tin for corrosion resistance), the total thickness can be controlled (5-20 μm), and the interface between layers creates additional corrosion barriers. The segmentation approach transforms a simple plating process into a more controlled multi-layer deposition process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described approach enhances the durability and suitability of plated articles for applications like lightning protection by providing high electrical conductivity and corrosion resistance with a lower melting point, making them more effective than pure copper.
Implementation Method 1
the layers of tin comprising the tie/seed layer are sputter coated layers. In some embodiments, the layers of copper comprising the tie/seed layer are sputter coated layers.
Data Source
AI summary
A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 μm, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.