Tin-Based Jointing Material for Semiconductor Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional jointing materials for semiconductor devices, such as silver paste, suffer from degraded heat dissipation properties due to increased temperature and reliability issues like crack generation and sulfurization, especially when driving current is increased for higher luminance in gallium nitride light emitting elements.
Innovation Solution
A jointing material comprising a solder alloy with tin as the main component, combined with elements like titanium, zirconium, or vanadium that form compounds with tin and carbon, providing a high thermal conductivity coefficient and resistance to high-temperature and high-humidity conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If silver paste is used as jointing material, then thermal conductivity is improved, but reliability deteriorates due to crack generation and sulfurization
Solution Approach 1:
The patent changes the material composition parameters by replacing silver paste with a solder alloy where tin is the main component (70-99.9 wt%) and adding specific compound-forming elements (0.1-30 wt%). This parameter change achieves both high thermal conductivity (comparable to or exceeding silver paste) and high reliability by forming stable intermetallic compounds that prevent crack generation and sulfurization at the interface
Solution Approach 2:
The patent creates a composite jointing material system consisting of tin-based solder alloy combined with elements that form compounds with both tin and carbon (such as titanium, zirconium, or vanadium). This composite structure provides both excellent thermal conductivity and enhanced reliability through the formation of stable interfacial compounds that prevent degradation
2Illumination intensity
If driving current is increased for higher luminance, then luminance is improved, but heat generation increases causing temperature rise
Solution Approach 1:
The patent changes the thermal management parameters by introducing a solder alloy with optimized composition (tin 70-99.9 wt% plus compound-forming elements 0.1-30 wt%) that achieves superior thermal conductivity. This enables the system to dissipate the increased heat generated at higher driving currents, allowing higher luminance to be achieved without excessive temperature rise
3Object-generated harmful factors
If traditional solder alloy is used, then lead-free requirement is met, but heat dissipation property and reliability are insufficient
Solution Approach 1:
The patent optimizes the compositional parameters of lead-free solder alloys by specifying tin as the main component (70-99.9 wt%) and adding compound-forming elements (0.1-30 wt%). This parameter optimization achieves both lead-free compliance and superior heat dissipation reliability by forming stable intermetallic compounds at the interface that prevent crack generation and maintain thermal conductivity
Solution Approach 2:
The patent develops a composite lead-free solder alloy system combining tin with elements that form compounds with both tin and carbon (titanium, zirconium, vanadium). This composite material provides both lead-free compliance and enhanced heat dissipation reliability through stable interfacial compound formation that prevents degradation under thermal stress
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The jointing material effectively maintains high heat dissipation properties and reliability, ensuring efficient heat transfer and longevity of semiconductor devices under demanding conditions.
Implementation Method 1
at least one type of element at 0.1 wt % to 30 wt %, the element being capable of forming a compound with each of tin and carbon
Implementation Method 2
a solder alloy including as its main component tin that has a high heat dissipation property and high reliability
Data Source
AI summary
A jointing material includes: at least one type of element at 0.1 wt % to 30 wt %, the element being capable of forming a compound with each of tin and carbon; and tin at 70 wt % to 99.9 wt % as a main component.