Tin Oxide Layer for Copper Substrate Bonding Strength
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Solution Overview
Problem
The existing wavelength converting apparatuses face challenges in increasing the strength of the joining between the copper substrate and the wavelength converting layer, which affects the quality and reliability of the apparatus.
Innovation Solution
A wavelength converting apparatus is configured with a base made of copper or a copper alloy, a copper oxide layer, a tin oxide joining reinforcing layer, a joining layer, and a wavelength converter. The tin oxide layer enhances the adhesion between the base and the joining layer, and suppresses the diffusion of copper atoms, thereby increasing the joining strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a silver layer and nanosilver layer are used as the second intermediate layer to bond the copper substrate and wavelength converting layer, then the bonding process can be completed, but the joining strength between the copper substrate and wavelength converting layer is insufficient
Solution Approach 1:
A tin oxide intermediate layer is introduced between the copper substrate and the wavelength converting layer to serve as a mediator. This intermediate layer enhances the bonding interface by reacting with copper to form a strong chemical bond, thereby significantly improving the joining strength and bonding quality between the copper substrate and wavelength converting layer.
Solution Approach 2:
The chemical composition and oxidation state of the intermediate layer are optimized by using tin oxide with specific properties. The tin oxide layer undergoes chemical transformation during bonding to form a strong intermetallic compound with copper, changing the bonding mechanism from physical adhesion to chemical bonding, thus enhancing joining strength.
2Strength
If the joining layer structure is simplified to reduce manufacturing complexity, then the manufacturing process becomes easier, but the joining strength between the base and wavelength converter decreases
Solution Approach 1:
The tin oxide layer serves as an effective intermediate layer that simplifies the overall joining structure while maintaining high bonding strength. Instead of requiring complex multi-layer metal combinations, the tin oxide intermediate layer provides a simple yet effective bonding mechanism through chemical reaction with copper, reducing structural complexity while enhancing joining strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced joining strength between the base and the wavelength converter leads to a more stable and reliable wavelength converting apparatus, improving the overall performance and longevity of the light source and projector systems.
Implementation Method 1
a joining reinforcing layer being a tin oxide layer which contains tin oxide and is layered at the copper oxide layer
Implementation Method 2
a copper oxide layer formed at a first surface of the base
Implementation Method 3
a wavelength converter that converts the excitation light incident thereon into fluorescence having a second wavelength band different from the first wavelength band
Data Source
AI summary
A wavelength converting apparatus includes a base made of one of copper and a copper alloy; a copper oxide layer formed at a first surface of the base; a joining reinforcing layer being a tin oxide layer which contains tin oxide and is layered at the copper oxide layer; a joining layer disposed at the joining reinforcing layer; and a wavelength converter disposed at the joining layer.