Tine Workpiece Support Structure for Random Access Handling
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Solution Overview
Problem
Conventional wafer support and carrier architectures face challenges such as inefficient wafer mapping, increased complexity with larger wafers, and difficulties in simultaneous multiple wafer handling due to the need for precise and complex end effector movements, which can result in damage and contamination.
Innovation Solution
A tine structure with cantilevered supports that expose the wafer's peripheral edge and bottom surface, allowing end effectors to access wafers without traversing the entire wafer surface, enabling efficient random access and reduced risk of damage during handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional fixed-pitch shelves are used to support wafers, then wafers can be stored in the container, but access to the wafer's peripheral edge is blocked and complex end effector movements are required
Solution Approach 1:
The support structure is segmented into multiple tines rather than using solid shelves, creating gaps between support elements that allow end effectors to access wafer edges and bottom surfaces more easily
Solution Approach 2:
The support structure transitions from horizontal shelf surfaces to vertical tine structures, allowing end effectors to approach wafers from the side and bottom rather than requiring top-down access through the wafer stack
2Adaptability or versatility
If end effector blade thickness increases to maintain deflection characteristics for larger wafers, then larger diameter wafers can be handled, but pitch between wafers must increase reducing storage capacity
Solution Approach 1:
The end effector approaches wafers from the side and bottom through the tine gaps rather than from the top, eliminating the need for thick blades and allowing tight wafer spacing while maintaining structural integrity for large wafer handling
3Reliability
If break-the-beam mapping is used to determine wafer position, then reliable wafer detection is achieved, but expensive and complex sensing mechanisms are required
Solution Approach 1:
The tine support structure itself provides detection functionality through its interaction with wafers, eliminating the need for separate break-the-beam sensing systems by using the mechanical presence/absence of wafers on tines as the detection mechanism
4Ease of operation
If end effector must travel between adjacent wafers to access them, then random access is possible, but travel time increases and risk of accidental contact increases
Solution Approach 1:
The segmented tine structure creates direct access paths through the gaps between tines, allowing end effectors to reach wafers more directly without extensive travel between tightly spaced wafers
Data Source
AI summary
A workpiece container stores at least one workpiece having a bottom surface and a peripheral edge. In one embodiment, a workpiece support structure is located within the container enclosure, which forms multiple vertically stacked storage shelves within the enclosure. Each storage shelf includes, in one embodiment, a first tine and a second tine for supporting the workpiece in a substantially horizontal orientation. The bottom surface and peripheral edge of a workpiece seated on a storage shelf extends beyond the outer edge of both the first tine and the second tine. An end effector may engage these extended portions or “grip zones” of the workpiece.