Tiny RFID Die Layout for IC Authentication Without Area Penalty

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Solution Overview

Problem

The widespread adoption of integrated circuits (ICs) has led to the rise of counterfeit ICs, posing significant threats to the electronics industry, economy, and public safety, necessitating the development of anti-counterfeiting measures, particularly through tiny RFID tags embedded in ICs to ensure authenticity and functionality.

Innovation Solution

The integration of a tiny RFID tag, less than 0.1 mm² in area, primarily digital and utilizing dual-phase RF-only logic, embedded in ICs, which can be manufactured using portable digital IP blocks and shared power supply transistors, with data encoded at the foundry, enabling secure authentication and unlocking device capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If RFID technology is incorporated into ICs to enhance anti-counterfeiting measures, then authentication reliability is improved, but device area increases

Engineering Contradiction:
Improveauthentication reliabilityVSAvoiddevice area
Core Design Contradiction:
ReliabilityVSArea of moving object

Solution Approach 1:

The patent merges the RFID tag with the IC by embedding the RFID tag directly into the IC substrate, creating a unified structure where the RFID tag and IC share the same physical space and power supply infrastructure, thereby minimizing area overhead while maintaining authentication functionality

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The IC is designed to serve multiple functions: it acts as both the main integrated circuit for device operation and as the host for the embedded RFID tag for authentication purposes, eliminating the need for separate dedicated authentication hardware and reducing overall device area

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Area of moving object

If the RFID tag area is reduced to less than 0.1 mm², then device miniaturization is achieved, but manufacturing complexity increases

Engineering Contradiction:
ImproveRFID tag areaVSAvoidmanufacturing ease
Core Design Contradiction:
Area of moving objectVSEase of manufacture

Solution Approach 1:

The RFID tag is segmented into minimal essential components that can be implemented using standard foundry process blocks, allowing the tiny RFID tag to be manufactured using existing CMOS fabrication processes without requiring specialized or complex manufacturing steps

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs parameter changes in the RFID tag design, including using dual-phase RF-only logic and shared power supply transistors, to reduce the tag's area to less than 0.1 mm² while maintaining functionality through optimized electrical characteristics and compact circuit topology

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides reliable and efficient authentication of ICs, preventing counterfeit usage and ensuring device safety and security by verifying RFID data against predefined criteria, applicable in various fields requiring security and access control.

Implementation Method 1

Radio-Frequency Identification (RFID) technology that allows for the identification and tracking of objects using radio waves

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS20250356147A1Tiny RFID Die for Secure AI/ML Feature Enablement
Publication Date: 2025.11.20 VIKING DISCOVERIES LLC
  • US20250356147A1 patent drawing
  • US20250356147A1 patent drawing
  • US20250356147A1 patent drawing

AI summary

A method of enabling a capability of an electronic device includes interrogating, with a radio frequency reader, a passive wireless identifier that is embedded within and shares a power grid with logic circuitry of an integrated circuit die present in the electronic device. The passive wireless identifier occupying no more than about 0.1 mm2 of die area. Identifier data is received from the passive wireless identifier. The method also includes verifying that the identifier data satisfies predetermined unlock criteria. The capability of the electronic device is enabled in response to the verifying.