Tire Device Adhesive Pattern for Uniform Bonding With Less Glue
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Solution Overview
Problem
Existing methods for attaching devices, such as RFID patches, to tires are inefficient, unreliable, and wasteful, often resulting in detachment, uneven adhesive application, and excessive glue use.
Innovation Solution
A method involving the application of a uniform adhesive layer to the device, using an inner and outer line of adhesive, spread over the device's surface to ensure a robust and uniform attachment to the tire, utilizing adhesives like Cyberbond 2240™ or Sigel 3M™, with specific pressure and timing to achieve a secure bond.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a uniform layer of adhesive is applied to cover substantially all of the device, then the reliability of attachment is improved, but the quantity of adhesive required increases
Solution Approach 1:
The adhesive application is segmented into two distinct patterns: an inner portion applied to the central region and an outer line applied to the periphery. This segmentation allows the adhesive to be distributed more efficiently, providing reliable attachment at critical areas (center and edges) without requiring complete coverage of the entire device surface, thus reducing total adhesive quantity while maintaining attachment reliability.
Solution Approach 2:
The adhesive is applied with different patterns in different regions: a concentrated inner portion at the center and a linear outer pattern at the periphery. This local differentiation ensures that adhesive is placed where it provides maximum bonding effectiveness (at the center for structural integrity and at the edges for perimeter sealing) rather than uniformly across the entire surface, optimizing both reliability and adhesive efficiency.
2Manufacturing precision
If pressure is applied to spread the adhesive over the device, then the manufacturing precision of the adhesive layer is improved, but the loss of substance through discharge increases
Solution Approach 1:
Instead of applying adhesive in excessive amounts that would require heavy spreading pressure (causing discharge), the method applies adhesive in controlled partial amounts at specific locations (inner portion and outer line). This partial application approach achieves the necessary uniformity through moderate pressure without exceeding the device's containment capacity, preventing adhesive discharge while still achieving manufacturing precision.
Solution Approach 2:
The pressure application acts as an intermediary mechanism that transforms the discrete adhesive deposits (inner portion and outer line) into a uniform distributed layer. By using pressure as the mediating force, the system achieves homogeneous adhesive distribution without requiring excessive adhesive application, thereby preventing discharge while attaining the desired layer uniformity.
3Strength
If adhesive is applied to ensure secure attachment, then the strength of bonding is improved, but the loss of time in the application process increases
Solution Approach 1:
The adhesive application is segmented into two quick steps: applying an inner portion to the center and applying an outer line at the periphery. This segmentation allows for rapid application using simple patterns rather than time-consuming uniform coating processes, achieving secure bonding strength through strategic placement while minimizing application time.
Solution Approach 2:
The adhesive pattern design (inner portion plus outer line) allows the adhesive to self-distribute and self-bond effectively without requiring complex application equipment or prolonged processing. The strategic placement of adhesive at the center and periphery enables the material to naturally form effective bonds, reducing the need for time-intensive manual adjustment or extended curing supervision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures a reliable, time-efficient, and cost-effective attachment of devices to tires, maintaining device integrity and minimizing adhesive waste, while providing improved monitoring and communication capabilities.
Implementation Method 1
a method of adhering a device, such as a radio frequency identification patch, to a tire
Implementation Method 2
Applying the device to the tire may comprise applying pressure to the device. This may be to spread the inner portion and outer line of adhesive over the device for creating a uniform film of adhesive between the device and the tire
Data Source
AI summary
The present invention relates to a method of adhering a device to a tyre, the method comprising: applying adhesive to a surface of the device, wherein applying adhesive comprises: applying an inner portion (14) of adhesive to the surface of the device (20); and applying an outer line (16) of adhesive to the surface of the device, wherein the outer line of adhesive at least partially surrounds the inner portion of adhesive; the method further comprising: applying the device to the tyre, wherein applying the device (20) to the tyre comprises: applying pressure to the device to spread the inner portion (14) and outer line (16) of adhesive over the device for creating a uniform film of adhesive between the device and the tyre. An embodiment of the invention relates to a method for manufacturing a tyre comprising said method of adhering a device to a tyre.